Czech

Not applicable.

The subject knowledge on the secondary school level is required.

Practical excercises are situated in Laboratory of microelectronic technologies and packaging, always in groups of maximum 6 students according to timetable set at the beginning of the semester. Compensation is possible only after personal agreement with teacher in exceptional cases (on the basis of a medical certificate).

Lab exercise :
1. Design of a hybrid integrated circuit.
2. Practical realization of hybrid integrated circuit.
3. Measurement of thick film resistors by four-wire method.
4. Trimming od thick film resistors and their statistical evaluation.
5. Soldering and measuring of temperature profiles.
6. Packaging and interconnection.

The goal is to introduce students to knowledge about technology of microelectronics components, circuits and systems, that they will be able to join praxis as well to continue in the master study.
Basic knowledge and orientation in the field of design and manufacture of modern electronic circuits, devices and systems (hardware), which will enable the student to define, describe and also explain and possibly calculate basic parameters from the above mentioned problems.

Student after passing the subject:
1. Enables the basic issues of electronic hardware, its importance, its composition and its basic use
2. Understand and explain the basic nature of individual electronic components and describe their principles of implementation and use
3. Explains the theoretical function of basic hardware components and identifies its most commonly used types, names their parameters in relation to use in various applications
4. Is able to design hybrid integrated circuits, demonstrate and clarify the basic principles of their implementation and execution
5. Undertakes or supports an opinion on its own application in manufacturing, service and design institutions in the field of microelectronics and electrotechnics, and also develops basic prerequisites for master's studies

Not applicable.

Not applicable.

AXELEVITCH, Alexander. Thin Films Technology: Practical Manual For The Laborat. Thin Films Technology: Practical Manual For The Laborat, 2021. ISBN 9789811246326 (CS)
SESHAN, Krishna, SCHEPIS, Dominic. Handbook of Thin Film Deposition. 2024. ISBN 0443135231 (CS)
SZENDIUCH, Ivan. Mikroelektronika a technologien součástek. Skriptum VUR vBrně, ÚMEL, ISBN 978-80-214-3960-3. (CS)
SZENDIUCH, Ivan. Základy technologie mikroelektronických obvodů a systémů. Brno: VUTIUM, 2006. ISBN 80-214-3292-6. (CS)
TUMMALA, Rao. Fundamentals of Microsystems Pacakaging. McGraw-Hill, New York, 2001, ISBN 0-07-137169-9. (EN)

SZENDIUCH, Ivan. Mikroelektronické montážní technologie. VUTIUM, 1997. (CS)