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Course detail
FEKT-BPC-MTSAcad. year: 2025/2026
The subject deals with the new, modern electronics components and technologies (hardware) with the impact on understanding of microelectronic passives and actives. Interconnection and packaging with new integration solutions are objectivesduring the whole life cycle starting with design, going through production processes and finishing with liquidation. It´s concerned to Surface Mount Technology and Hybrid Integrated Circuits, which are based on thick and thin film technologies. New performances of packaging, as Multi Chip Modules,, Chip Scale Packages, Flip Chips and Wafer Level Packages etc. are described and discused including modern semiconductor chips, going to 3D packages. Regarding to recieve the complex wiev for praxis in microelectronics technology area, selected parts from quality and environmental managment are included. The subject offers also good base about electronics hardware, in the whole cycle from design , production, use, servis and liquidation. That gives for student the possibility to involve in the praxis as well to continue in master degree study.
Language of instruction
Number of ECTS credits
Mode of study
Guarantor
Department
Entry knowledge
Work in the laboratory is subject to a valid qualification of "instructed person", which students must obtain before starting classes. Information on this qualification can be found in the Dean's Directive Acquainting Students with Safety Regulations.
Rules for evaluation and completion of the course
Up to 42 points for work in the semester.
Up to 58 points per exam.
Practical excercises are situated in Laboratory of microelectronic technologies and packaging, always in groups of maximum 6 students according to timetable set at the beginning of the semester. Compensation is possible only after personal agreement with teacher in exceptional cases (on the basis of a medical certificate).
Aims
Study aids
Prerequisites and corequisites
Basic literature
Recommended reading
Classification of course in study plans
Lecture
Teacher / Lecturer
Syllabus
Fundamentals seminar
Laboratory exercise
Project
Design of a hybrid integrated circuit.