Course detail

Elektromagnetická kompatibilita polovodičových součástek

FEKT-BPC-EMKAcad. year: 2025/2026

The subject is devoted to the issue of electromagnetic compatibility (EMC) of semiconductor components and electronic circuits. This area is currently being developed by manufacturers of semiconductor components, and therefore the presented issue is promising for the further electrical engineering practice of students in the field of Microelectronics. The aim of this subject is to familiarize students with basic terms in the field of electromagnetic compatibility, to state possible connections of interference propagation and methods of increasing the electromagnetic resistance of semiconductor components and circuits. In addition, students will learn about EMC measurement processes in relation to normative references, especially to the IEC 61967 and IEC 62132 standards. 

Language of instruction

Czech

Number of ECTS credits

5

Mode of study

Not applicable.

Guarantor

prof. Ing. Jan Leuchter, Ph.D.

Department

Department of Microelectronics (UMEL)

Entry knowledge

Basic knowledge of physics, mathematics and electrical circuits is required. Completion of BPC-ESO and BPC-EL1 is a mandatory prerequisite.

Work in the laboratory is subject to a valid qualification of "instructed person", which students must obtain before starting classes.  Information on this qualification can be found in the Dean's Directive Acquainting Students with Safety Regulations. 

Rules for evaluation and completion of the course

Credit conditions: completion of measured tasks and handing in prepared protocols in the required quality.

Exam conditions: proof of knowledge of the subject in the written and oral parts of the exam.

Point evaluation (max. 100 points): max. 30 points for work during the semester; max. 70 points per exam. The final exam consists of two parts (written and oral) and is evaluated for a total of 70 points. 

 

Aims

The aim of this  subject is to explain the basic terms in the field of electromagnetic compatibility (EMC) and to state the possible causes of electromagnetic interference in electrotechnical practice, especially in the field of semiconductors. The subject is devoted to coupling mechanisms of interference transmission as well as electromagnetic immunity. A partial goal of the course is to acquire basic knowledge of the content of the standards: CISPR; FCC Part XX; DO-160; EN 550XX; EN 61000-3-X; IEC 61000-4-X; IEC 61967 and IEC 62132. During practical exercises, the subject is oriented towards practical skills in the field of measuring semiconductor components and switched circuits with SiC and GaN devices. 

Study aids

Not applicable.

Prerequisites and corequisites

Not applicable.

Basic literature

Costa, F., Laboure, E., Revol, B.: Electromagnetic compatibility in power electronics. London, England: ISTE, 2014. ISBN 978-1848215047. (EN)
ČSN EN IEC 61967; Integrované obvody - Měření elektromagnetických emisí (CS)
ČSN EN 61000-4-1; Elektromagnetická kompatibilita (EMC). Část 4: Zkušební a měřicí technika. Oddíl 1: Přehled zkoušek odolnosti. Základní norma EMC (CS)
ČSN EN 61000-4-2; Elektromagnetická kompatibilita (EMC) - Část 4-2: Zkušební a měřicí technika - Elektrostatický výboj - zkouška odolnosti (CS)
ČSN EN 62132; Integrované obvody - Měření elektromagnetické odolnosti (CS)
MONTROSE, Mark I. EMC and the Printed Circuit Board: design, theory, and layout made simple. New York: IEEE Press, 1999. ISBN 978-0-7803-4703-8. (EN)
Svačina, J.: Úvod do elektromagnetické kompatibility, VUTIUM, FEKT VUT v Brně (CS)

Recommended reading

Not applicable.

Classification of course in study plans

  • Programme BPC-NCP Bachelor's 3 year of study, winter semester, compulsory-optional

Type of course unit

 

Lecture

26 hod., optionally

Teacher / Lecturer

prof. Ing. Jan Leuchter, Ph.D.

Syllabus

      1. Electromagnetic Compatibility (EMC) – fundamentals.
      2. Causes of electromagnetic interference and sources of interference.
      3.  Electromagnetic compatibility in power electronics. Interference coupling mechanisms.
      4.  Legislation and Standard. International EMC compliance requirements.
      5.  Basic standards – (CISPR; FCC Part XX; DO-160; EN 550XX;  EN 61000-3-X; IEC 61000-4-X;  IEC 61967 a IEC 62132). Product standards. The limist of harmonics current.
      6. Emissions measurements. Immunity tests.
      7. Conducted and radiated perturbations in static power  switching converters.
      8. EMC design for electronics.
      9. EMC design for immunity. Effects of ESD. Immunity to electrostatic discharges. IEC 61000-4-2 testing.
      10. EMC of Electrical Devices (IC-EMC).
      11. Measurement of conducted and radiated electromagnetic disturbances from integrated circuits. Standard – IEC 61967.
      12. Measurement of electromagnetic immunity of integrated circuits. Standard - IEC 62132.
      13. EMC testing and limits for automotive and aircraft electronics. EMC legislative study of an insulated DC-DC power converter and its component intended for integration into automobile and aircraft.

     

    Exercise in computer lab

    13 hod., compulsory

    Teacher / Lecturer

    prof. Ing. Jan Leuchter, Ph.D.

    Syllabus

    1. Introduction,

    2. Simulation of the influence of the load type during fast switching and switching off of Si MOSFET

    3. Measurement of the effect of the load type during fast switching and switching off of Si MOSFET and SiC MOSFET in power electronics

    4. Use and design of protection of electronic circuits against overvoltage (MOV, TVS)

    5. Verification of measures leading to the reduction of the influence of the load in the switched circuit from the point of view of EMI

    6. Modeling of binding mechanisms of transmission of interfering signals

    7. Measuring the transmission of interfering signals – inductive coupling, capacitive coupling

    8. Calculations of requirements for shielding efficiency of shielding materials and measurement of coaxial cable (shielding quality)

    9. Work with standards

    10. Setting up the measuring workplace according to the standards for EMI, EMS measurement

    11. EMC analyses of semiconductor components I

    12. EMC tests of semiconductor components II

    13. EMC tests of semiconductor components III (ON-SEMI)

     

     

    Laboratory exercise

    13 hod., compulsory

    Teacher / Lecturer

    prof. Ing. Jan Leuchter, Ph.D.

    Syllabus

    1. Introduction,

    2. Simulation of the influence of the load type during fast switching and switching off of Si MOSFET

    3. Measurement of the effect of the load type during fast switching and switching off of Si MOSFET and SiC MOSFET in power electronics

    4. Use and design of protection of electronic circuits against overvoltage (MOV, TVS)

    5. Verification of measures leading to the reduction of the influence of the load in the switched circuit from the point of view of EMI

    6. Modeling of binding mechanisms of transmission of interfering signals

    7. Measuring the transmission of interfering signals – inductive coupling, capacitive coupling

    8. Calculations of requirements for shielding efficiency of shielding materials and measurement of coaxial cable (shielding quality)

    9. Work with standards

    10. Setting up the measuring workplace according to the standards for EMI, EMS measurement

    11. EMC analyses of semiconductor components I

    12. EMC tests of semiconductor components II

    13.  EMC tests of semiconductor components III (ON-SEMI)