Course detail

Electronic Components Production

FEKT-MPC-VSKAcad. year: 2025/2026

This course is focused on the fundamental physical principles of semiconductors and covers the complete spectrum from design to the manufacturing of these devices. It thoroughly addresses the development of semiconductor chips, the production of various types of devices, and the methods of their connection. Diodes and transistors receive special attention, including an analysis of the problems associated with their production. The explanation of issues includes individual manufacturing steps and phenomena that can occur during the production process. Laboratory exercises provide students with practical knowledge on how the structure of semiconductor components is created and how they work. Consequently, students acquire a comprehensive view of the technological processes used in semiconductor technologies. 

Language of instruction

Czech

Number of ECTS credits

6

Mode of study

Not applicable.

Guarantor

Ing. Imrich Gablech, Ph.D.

Department

Department of Microelectronics (UMEL)

Entry knowledge

Knowledge of physics and semiconductor technology at the bachelor's level is required. Working in the laboratory is conditional upon obtaining a valid qualification of "person competent for independent activity," which students must acquire before starting this course. Information regarding this qualification is provided in the Dean's Directive on Familiarization of Students with Safety Regulations.

Rules for evaluation and completion of the course

The conditions for course completion are established by the regulation issued by the guarantor.

  • 30 points - laboratory exercises
  • 70 points - final exam

Student must obtain at least 50 % of the points from each part of the assessment.

Theoretical exercises - calculations of oxidation times, diffusion, and depth of the semiconductor junction.
Laboratory exercises - production of a semiconductor chip in clean CF Nano laboratories and processing protocols.

Aims

The aim of the course is to provide students with fundamental knowledge of semiconductor technology, from the physical properties of semiconductors, through the principles of operation of semiconductor components, to their production and use. In the theoretical part, students will become familiar with the physical principles and properties of semiconductors and the basics of how semiconductor components work. The practical part of the course aims to develop basic knowledge and skills for production and work with semiconductors in clean laboratories, which will enable students to participate in research, development, and production projects and possibly continue in scientific activities.

Upon completing the course, the student will:

  • understand the basics of semiconductor components function and be able to describe their use,
  • know the basic principles of semiconductor component production,
  • be familiar with the individual steps in the production process of basic semiconductor components and be able to apply them to experimental work in the laboratory,
  • gain basic awareness and skills for working in cleanrooms,
  • be able to find employment in production, service, and design institutions in the field of semiconductor components. 

Study aids

Not applicable.

Prerequisites and corequisites

Not applicable.

Basic literature

DIVENTRA M., EVOY S., HEFLIN J. R.: Introduction to Nanoscale Science and Technology. Kluwer Academic Publishers, Boston 2004 (EN)
I. Szendiuch, V. Musil, J. Stehlík. Výroba součástek a konstrukčních prvků. Elektronický studijní text. 2006. 84 str., VUT FEKT Brno. Brno: VUT Brno, 2006. s. 1 ( s.) (CS)
MUSIL, V. a kol.: Výroba součástek a konstrukčních prvků. Nanotechnologie. Prezentace projektu KISP. VUT v Brně, 2015 (CS)
POOLE,C.P.(JR). -OWENS, F.J.: Introduction to Nanotechnology, Wiley Interscience, 2003 ISBN:0-471-07935-9 (EN)
STRAKOŠ, V.: Výroba součástek a konstrukčních prvků. Prezentace projektu KISP, VUT v Brně, 2015 (CS) (CS)
SZENDIUCH, I. a kol. Technologie elektronických obvodů a systémů. GA102/00/ 0969. GA102/00/ 0969. Brno: Nakladatelství VUTIUM, Brno, 2002. 289 s. ISBN: 80-214-2072- 3. (CS)
YING J. Y.: Nanostructured Materials. Academic Press, San Diego 2001 STREETMAN, B.G. –BANERJEE, S.K.: Solid state electronic devices. Prentice Hall, 2010, ISBN 978-0-13-245479-7 (EN)

Recommended reading

Not applicable.

Classification of course in study plans

  • Programme MPC-NCP Master's 1 year of study, winter semester, compulsory
  • Programme MPC-MEL Master's 2 year of study, winter semester, compulsory

Type of course unit

 

Lecture

39 hod., optionally

Teacher / Lecturer

Ing. Imrich Gablech, Ph.D.

Syllabus

    • 1. Introduction to semiconductors
      • Basic physical principles 
      • PN junctions and metal-semiconductor
      • Diodes, BJT, JFET, MOSFET
    • 2. Substrates for semiconductor manufacturing
      • Substrate production and utilization
      • Ge, Si, GaAs, GaN a SiC
      • Properties
    • 3. Oxidation and epitaxial layers
      • Preparation methods of SiO2 and Si
      • Oxide integrity
    • 4. Lithographic methods
      • Photoresists
      • Contact and non-contact methods
      • Resolution limits
    • 5. Semiconductor doping
      • Diffusion
      • Implantation
    • 6. PVD techniques for thin film preparation and their properties
      • Evaporation and sputtering techniques
      • Metallization
      • Electromigration
    • 7. CVD techniques for thin film preparation and their properties
      • Basic CVD techniques and plasma-assisted techniques
      • Mechanical properties
      • Electrical properties
    • 8. Etching processes
      • Dry and wet etching techniques
      • Surface and bulk micromachining
      • Selectivity
    • 9. Physical methods for imaging and determining thin film and substrate properties
      • Surface topography and appearance
      • Material analysis
    • 10. Layout creation for manufacturing
      • Rules
      • ESD protection 
      • HW security
    • 11. Selected manufacturing processes of semiconductor devices
      • Classical integrated circuits
      • Modern integrated circuits
      • MEMS and sensors
    • 12. Testing and interconnections of semiconductor devices
      • IV characteristics
      • Dielectric layer testing

 

Laboratory exercise

26 hod., compulsory

Teacher / Lecturer

Ing. Imrich Gablech, Ph.D.

Syllabus

    • 1. Course organization and cleanroom safety.
    • 2. Theory of oxidation and diffusion - numerical exercise.
    • 3. Qualification for entry into cleanrooms - test.
    • 4. Initial introduction to cleanrooms.
    • 5. Working with photoresist, spincoating, UV exposure and development, measurement of photoresist thickness.
    • 6. Wet etching of hard mask for diffusion, measurement of oxide thickness.
    • 7. Oxidation and wet etching of oxide for contacts.
    • 8. Metallization using vacuum techniques, lift-off method.
    • 9. Dry etching of metallization, direct laser exposure, implementation of custom patterns.
    • 10. Chip inspection using SEM, basic electrical characterization of manufactured chips.