Course detail

Design and Technology of Electronic Equipments

FEKT-MPC-KTEAcad. year: 2025/2026

Lectures are focus on the construction of the device as a whole, including its potential launch in the market. This involves designing and constructing electronic devices and introducing them into production. The appropriate selection of components is crucial from an overall design perspective. Mechanical construction, device design, and circuit board design are essential aspects. Additionally, considerations related to cooling, methods of heat transfer, and division of cooling systems based on heat removal methods are vital. Ensuring the reliability of electronic devices and exploring possibilities for technical diagnostics are key. Protection against electric shock due to current is also addressed. Proper grounding and shielding play a significant role. Achieving electromagnetic compatibility and correctly implementing interference suppression circuits are essential. Furthermore, adherence to legal requirements regarding equipment operation, necessary types of revisions, and checks during electrical equipment usage is critical. Lastly, safeguarding industrial property, understanding its importance, and recognizing concepts such as invention, patent, industrial design, utility model, and trademark are fundamental. 

Language of instruction

Czech

Number of ECTS credits

5

Mode of study

Not applicable.

Guarantor

doc. Ing. Pavel Šteffan, Ph.D.

Department

Department of Microelectronics (UMEL)

Entry knowledge

The subject knowledge on the Bachelor´s degree level is requested.

Rules for evaluation and completion of the course

Practicals - 30 points; minimum 20 points.
Final exam - 70 points; minimum 30 points.
The content and forms of instruction in the evaluated course are specified by a regulation issued by the lecturer responsible for the course and updated for every academic year.

Aims

The course aims to familiarize students with the procedures and practical principles of designing electronic devices and equipment from both electrical and mechanical perspectives, within the context of an industrial setting. Attention is paid to acquainting students with relevant regulations to the extent necessary for a designer.

Topics covered include:

  • Requirements for electronic devices and equipment.
  • Construction and characteristics of signal connections, power supplies, and distribution - noise reduction and ground loops.
  • Parasitic phenomena and their suppression - input and output circuit couplings, parasitic capacitance and inductance, thermoelectric voltage, overvoltage on inductive loads, reflections on conductors, crosstalk.
  • Shielding against electric and magnetic fields, equipotential shielding.
  • Selection of components and application recommendations - discrete elements, operational amplifiers, comparators, electronic switches, A/D and D/A converters, sample-and-hold circuits, digital circuits, microprocessors.
  • Mechanical construction: control, operating, and indicating elements - front panel layout, instrument cabinet construction, heat dissipation, thermostats.
  • Printed circuit boards, wire harnesses, wire and component connections.
  • Safety requirements for device construction.

Students will gain specific application knowledge in electronic device construction that would otherwise require longer experience in development. Emphasis is placed on understanding the physical nature of parasitic phenomena so that knowledge can be applied to other cases. Students will learn to anticipate and solve various problems that arise during the development of new devices, both in the electrical and mechanical design aspects.

Upon completion of the course, students will be able to:

  • Explain the basic principles of mechatronics.
  • Explain the technical preparation process for production.
  • Design electronic circuits with discrete components and integrated circuits.
  • Describe the methods used in electromagnetic compatibility (EMC).
  • Describe methods for securing signal connections.
  • List parasitic phenomena in electronic circuits.
  • Explain shielding methods.
  • Explain methods of cooling electronic devices.
  • Discuss options for designing printed circuit boards.
  • Discuss the advantages and disadvantages of surface mount technology.
  • Estimate safety requirements for regulations.
  • Describe the differences in design for aerospace and space technology.
  • Discuss reliability methods and quality control.
  • Describe the basic principles of industrial property protection.

Study aids

Not applicable.

Prerequisites and corequisites

Not applicable.

Basic literature

Scherz,P., Monk S. Practical Electronics for Inventors, McGraw-Hill Education TAB; 4 edition (March 24, 2016), ISBN-10: 1259587541 (EN)
WEETMAN, Catherine, 2020. A Circular Economy Handbook: How to Build a More Resilient, Competitive and Sustainable Business. 2nd edition. London, United Kingdom ; New York, NY: Kogan Page. ISBN 978-1-78966-531-4. (EN)

Recommended reading

Fowler, K.R. Electronic Instrument Design, Oxford University Press; 1st edition (2015), ISBN-10: 9780199458851 (EN)

Classification of course in study plans

  • Programme MPC-NCP Master's 2 year of study, winter semester, compulsory-optional
  • Programme MPC-MEL Master's 2 year of study, winter semester, compulsory-optional

Type of course unit

 

Lecture

26 hod., optionally

Teacher / Lecturer

doc. Ing. Pavel Šteffan, Ph.D.

Syllabus

Industrial property protection. The significance of industrial property protection. Copyright and related rights. Concepts of invention, patent, industrial design, utility model, trademark.
Electromagnetic compatibility and its importance. Sources of disruptive signals, paths of transmission of disruptive signals. Ways to increase device resistance to disruptive signals.
Power distribution in electronic devices. Characteristics of power connections, their properties, power distribution on PCBs. Influence of impedance of distribution, grounding conductor design, capacitors in power circuits.
Cooling of electronic components. Heat transfer methods, classification of cooling systems according to heat dissipation methods, heat dissipation from enclosed systems. Principles of electronic component cooling design - distribution of thermal resistances and possibilities of their influence.
Shielding in electronic circuits. Purpose of shielding and their classification according to the type of disruptive field. Sources of interference, methods, materials. Equivalent penetration depth and its relation to shielding quality. Magnetic materials and their suitability for shielding purposes. Shielding of interference sources - examples.
Requirements for device operation from a legislative perspective, required types of revisions and checks during the use of electrical equipment.

Exercise in computer lab

26 hod., compulsory

Teacher / Lecturer

doc. Ing. Pavel Šteffan, Ph.D.

Syllabus


Basic characteristics of CAM systems, their structure, and operation.
Setting directories and paths, project production.
Schematics module: Principles of drawing schematic diagrams, drawing levels, drawing method of schematic diagrams, design correctness check, library content.
Principles of board design, assembly technologies used, the influence of parasitic phenomena on the board, power distribution and blocking, thermal analysis.
Defining geometric elements, defining the board and package, board design, automatic routing, adjustment options.
Generating output data and their processing, export and import of data for production.
Connecting the system to the respective technological devices. Assessment of individual projects.