Course detail

Microelectronics and Assembly Technology

FEKT-BPA-MTSAcad. year: 2025/2026

The subject deals with the new, modern electronics components and technologies (hardware) with the impact on understanding of microelectronic passives and actives. Interconnection and packaging with new integration solutions are objectivesduring the whole life cycle starting with design, going through production processes and finishing with liquidation. It´s concerned to Surface Mount Technology and Hybrid Integrated Circuits, which are based on thick and thin film technologies. New performances of packaging, as Multi Chip Modules,, Chip Scale Packages, Flip Chips and Wafer Level Packages etc. are described and discused including modern semiconductor chips, going to 3D packages. Regarding to recieve the complex wiev for praxis in microelectronics technology area, selected parts from quality and environmental managment are included. The subject offers also good base about electronics hardware, in the whole cycle from design , production, use, servis and liquidation. That gives for student the possibility to involve in the praxis as well to continue in master degree study.

Language of instruction

English

Number of ECTS credits

6

Mode of study

Not applicable.

Guarantor

Ing. Alexandr Otáhal, Ph.D.

Department

Department of Microelectronics (UMEL)

Entry knowledge

The subject knowledge on the secondary school level is required.

Rules for evaluation and completion of the course

Requirements for completion of a course are specified by a regulation issued by the lecturer responsible for the course and updated for every year.
Practical excercises are situated in Laboratory of microelectronic technologies and packaging, always in groups of maximum 6 students according to timetable set at the beginning of the semester. Compensation is possible only after personal agreement with teacher in exceptional cases (on the basis of a medical certificate).

Lab exercise :
1. Design of a hybrid integrated circuit.
2. Practical realization of hybrid integrated circuit.
3. Measurement of thick film resistors by four-wire method.
4. Trimming od thick film resistors and their statistical evaluation.
5. Soldering and measuring of temperature profiles.
6. Packaging and interconnection.

Aims

The goal is to introduce students to knowledge about technology of microelectronics components, circuits and systems, that they will be able to join praxis as well to continue in the master study.
Basic knowledge and orientation in the field of design and manufacture of modern electronic circuits, devices and systems (hardware), which will enable the student to define, describe and also explain and possibly calculate basic parameters from the above mentioned problems.

Student after passing the subject:
1. Enables the basic issues of electronic hardware, its importance, its composition and its basic use
2. Understand and explain the basic nature of individual electronic components and describe their principles of implementation and use
3. Explains the theoretical function of basic hardware components and identifies its most commonly used types, names their parameters in relation to use in various applications
4. Is able to design hybrid integrated circuits, demonstrate and clarify the basic principles of their implementation and execution
5. Undertakes or supports an opinion on its own application in manufacturing, service and design institutions in the field of microelectronics and electrotechnics, and also develops basic prerequisites for master's studies

Study aids

Not applicable.

Prerequisites and corequisites

Not applicable.

Basic literature

Tummala,R.: Fundamentals of Microsystems Packaging, McGraw-Hill, NewYork, ISBN 0-07-1371699

Recommended reading

SZENDIUCH, I. Technologie elektronických obvodů a systémů. 1 vyd. Brno: Nakladatelství VUTIUM, Brno, 2002. ISBN 80-214-2072-3
Szendiuch,I.: Mikroelektronické montážní technologie, VUTIUM, 1997

Classification of course in study plans

  • Programme BPC-MET Bachelor's 0 year of study, winter semester, compulsory-optional

Type of course unit

 

Lecture

39 hod., optionally

Teacher / Lecturer

Ing. Alexandr Otáhal, Ph.D.

Syllabus

Microelectronics ant its development
Semiconductor chips - principle and their production
Basic performance of semiconductor chips and packaging
Thin and Thick Film Technology
Hybrid Integrated Circuits
SMD components for surface mount technology
Surface mount technology - technological operations
Technology of assembly (SMT)
Reliability Statistic Process Quality and cerfification in electronic production
Microelectronics and environment

Laboratory exercise

24 hod., compulsory

Teacher / Lecturer

Ing. Alexandr Otáhal, Ph.D.

Syllabus

HI´C design and HIOCAD
Screen printing and Thick Film firing
Resistors trimming and ultrasonic bonding
Reflow soldering and its temperature profile, lead free solders
Basic operation in SMT, assembly process