39 hod., optionally

Design of signal lines: symmetrical and non-symmetrical lines, properties of signal lines, execution of connections, printed circuits and their properties, optical lines
Supply sources: mains supply, mains switches, transformers, means of interference suppression (suppression capacitors, suppression chokes, suppression elements)
Supply voltage distribution: supply distribution in instrument housing and on printed circuit boards, distribution in the ground, galvanic separation of systems (impulse tranformers, optrons)
Parasitic events and their suppression: coupling in input and outtput circuits, coupling on line resistances, parasitic capacitances and inductances, transient resistances, thermoelectric voltage, overvoltage on inductive load
Signal transmission over long lines: reflections in the lines, crosstalk, charging and discharging the lines
Electric and magnetic field screening: electric field screening of systems and lines, magnetic field screening of systems and lines
Equipotential guarding: insulation ring guarding, teflon support point, examples of active insulation of critical points
Selection of discrete components and application recommendation: resistors, potentiometers and potentiometric trimmers, capacotors and capacitive trimmers, inductors, diodes, transistors (bipolar, unipolar; power, HF)
Application recommendation for analog and digital integrated circuits: operational and transimpedance amplifiers, analog multiplexersand demultiplexers, comparators and timers, D/A and A/D converters, digital integrated circuits, microprocessors
Mechanics design: regulation and control elements and their lay-out, communication and indication elements, lay-out of regulation and communication elements on the front panel of the instrument, graphic and technical aspects of the mechanical part of design, design of instrument housing
Mechanical resistance of devices: resistance to shocks, vibration, moisture, water; abstraction of heat from the device, cooling elements, temperature stabilization (thermostatic control)
Connection of conductors and components: technology of printed circuit production, soldered connections, wire-wrap connections, cut-in connections; technology of surface assembly
Safety requirements: fundamental requirements, types of instrument classes, work environment, danger-to-touch protection, insulation requirements, surface paths and distances, movable lead-in wires