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FEKT-CPSMAcad. year: 2010/2011
Basic materials for production of printed circuit boards (PCB), their properties, application and comparison with inorganic substrates. Technological procedures of production of single-, double- and multi-layer PCBs. New technological trends of PCB production with emphasis on microconnecting structures (HDI). Surface mount technology (SMT), throuh hole technology (THT) and combined mounting of electronic parts. Acquaintance with the mounting process starting by parts and used chemistry at the beginning up to repairs and quality requirements.
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Specification of controlled education, way of implementation and compensation for absences
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branch BC-MET , 3 year of study, winter semester, compulsory
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Exercise in computer lab
Laboratory exercise