Detail projektu

Aplikace časoprostorové reciprocity ve výpočetní elektromagnetické kompatibilitě

Období řešení: 02.01.2017 — 31.12.2018

Zdroje financování

Grantová agentura České republiky - Juniorské granty

- plně financující (2017-01-02 - 2018-12-31)

O projektu

Stále se zvyšující integrace a stále klesající odolnost elektronických digitálních systémů si naléhavě vyžadují vývoj přístupů v časové oblasti, které jsou schopny vyhodnotit možné transientní zdroje elektromagnetické interference (EMI) a tím zabezpečit bezproblémovou koexistenci a bezpečný provoz takových systémů. Tento projekt tudíž cílí na využití jedinečné odborné znalosti ve vývoji nových časoprostorových metod pro efektivní řešení problémů EMI, odolnosti a napájecí/signálové integrity v časové oblasti.

Popis anglicky
The ever increasing integration of electronic digital systems with their still decreasing immunity levels urgently call for the development of purely time-domain (TD) approaches capable of assessing potential transient electromagnetic interference (EMI) sources and thus securing such systems' smooth co-existence and safe operation. Operation of modern, digital devices and accompanied radiated EMI are inherently of the TD nature. The vast majority EMI/EMC techniques, however, are as yet defined in the frequency domain. Besides the fact that this way is not very computationally efficient, it in addition cannot plausibly handle signals with their discontinuous and causal characteristics. A way out of these issues is to construct EMI/EMC methods entirely in TD. As to the widespread contour-integral method (CIM), this idea has been initiated by the applicant who has introduced novel CIM-formulations in TD. Accordingly, this project aims at taking the advantage of the unique expertise to develop new, TD methods for efficient tackling TD EMI, immunity and Power/Signal-Integrity issues.

Klíčová slova
elektromagnetická kompatibilita;modelování v časové oblasti;princip reciprocity

Klíčová slova anglicky
electromagnetic compatibility; time-domain modeling; reciprocity theorems

Označení

GJ17-05445Y

Originální jazyk

čeština

Řešitelé

Štumpf Martin, doc. Ing., Ph.D. - hlavní řešitel
Kadlec Petr, doc. Ing., Ph.D. - spoluřešitel
Šeděnka Vladimír, Ing., Ph.D. - spoluřešitel

Útvary

Ústav radioelektroniky
- příjemce (02.01.2017 - nezadáno)
oddělení-REL-SIX
- spolupříjemce (02.01.2017 - 31.12.2018)

Výsledky

ŠTUMPF, M. A Generalization of the Time-Domain Cooray–Rubinstein Formula. IEEE Transaction on Electromagnetic Compatibility, 2017, vol. 59, no. 5, p. 1-4. ISSN: 0018-9375.
Detail

ŠTUMPF, M.; ANTONINI, G. Electromagnetic Field Coupling to a Transmission Line -- A Reciprocity-Based Approach. IEEE Transaction on Electromagnetic Compatibility, 2019, vol. 61, no. 6, p. 1-9. ISSN: 0018-9375.
Detail

KADLEC, P.; ŠEDĚNKA, V.; ŠTUMPF, M.; MAREK, M. Solution of an Inverse Scattering Problem Using Optimization with a Variable Number of Dimensions. In 2017 International Conference on Electromagnetics in Advanced Applications (ICEAA). 19. Verona, Italy: Politechnico di Torino, 2017. p. 976-979. ISBN: 978-1-5090-4450-4.
Detail

ŠTUMPF, M.; ŠEDĚNKA, V.; KADLEC, P. On Modeling of Excitation Ports in the Time-Domain Contour-Integral Method. In Proceedings of the 2017 International Conference on Electromagnetics in Advanced Applications (ICEAA). 19th Edition. Verona, Italy: 2017. p. 1292-1294. ISBN: 978-1-5090-4450-4.
Detail

ŠTUMPF, M. Coupling of Impulsive EM Plane-Wave Fields to Narrow Conductive Strips: An Analysis Based on the Concept of External Impedance. IEEE Transaction on Electromagnetic Compatibility, 2017, vol. 60, no. 2, p. 548-551. ISSN: 0018-9375.
Detail

ŠTUMPF, M. Electromagnetic Reciprocity in Antenna Theory. Hoboken, NJ, USA: IEEE-Wiley Press, 2017. 130 p. ISBN: 978-1-119-46637-6.
Detail

ŠTUMPF, M. The Time-Domain Compensation Theorem and Its Application to Pulsed EM Scattering of Multiport Receiving Antennas. IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, 2018, vol. 66, no. 1, p. 226-232. ISSN: 0018-926X.
Detail

KADLEC, P.; ŠEDĚNKA, V.; MAREK, M.; ŠTUMPF, M. Optimizing a Decoupling Capacitor on a PCB: A Fully Time-Domain Approach Based on PSO and TD-CIM. In ELECTROMAGNETIC COMPATIBILITY. INTERNATIONAL SYMPOSIUM. 2018. (EMC EUROPE 2018). 2018. Amsterdam, Nizozemsko: IEEE, 2018. p. 134-138. ISBN: 9781467396998.
Detail

ŠTUMPF, M. Controlling Pulsed EM Scattering of a One-Port Receiving Antenna. RADIO SCIENCE, 2018, vol. 52, no. 12, p. 1596-1603. ISSN: 1944-799X.
Detail

ŠTUMPF, M. Pulsed EM Field Computation in Planar Circuits: The Contour Integral Method. Boca Raton, FL, USA: CRC Press, 2018. 244 p. ISBN: 9781138735248.
Detail

ŠTUMPF, M.; VANDENBOSCH, G.; LAGER, I. Modified Kirchhoff Diffraction of Pulsed EM Waves Radiated from a Slot-Excited Fabry-Pérot Resonator Antenna. In Proceedings of the 12th European Conference on Antennas and Propagation. Institution of Engineering and Technology, 2018. p. 1-4. ISBN: 9781509037421.
Detail

ŠTUMPF, M. The Time-Domain Compensation Contour Integral Method (TD-C2IM) – A New Approach to the Analysis of Irregularly-Shaped Parallel-Plane Circuits. In Proceedings of 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity. Long Beach, CA: IEEE EMC Society, 2018. p. 161-164. ISBN: 978-1-5386-6620-3.
Detail

ŠTUMPF, M. Pulsed Vertical-Electric-Dipole Excited Voltages on Transmission Lines Over a Perfect Ground—A Closed-Form Analytical Description. IEEE Antennas and Wireless Propagation Letters, 2018, roč. 17, č. 9, s. 1656-1658. ISSN: 1536-1225.
Detail

ŠTUMPF, M. Evaluating the Ground Impedance-A New Methodology Based on EM Reciprocity. IEEE Transaction on Electromagnetic Compatibility, 2019, vol. 61, no. 3, p. 928-934. ISSN: 0018-9375.
Detail

KADLEC, P.; MAREK, M.; ŠTUMPF, M.; ŠEDĚNKA, V. PCB Decoupling Optimization with Variable Number of Capacitors. IEEE Transaction on Electromagnetic Compatibility, 2018, vol. 20, no. 4, p. 1841-1848. ISSN: 0018-9375.
Detail

ŠTUMPF, M. Extending the Validity of the Time-Domain Contour Integral Method Using the Admittance-Wall Boundary Condition. In Proceedings of The 2017 IEEE International Symposium on Electromagnetic Compatibility. Washington, D.C, USA: IEEE EMC Society, 2017. p. 751-755. ISBN: 978-1-5386-2230-8.
Detail

ŠEDĚNKA, V.; ŠTUMPF, M.; KADLEC, P.;: TD-PCBSv1; Time Domain Printed Circuit Board Solver. PC-489. URL: http://www.urel.feec.vutbr.cz/web_documents/produkty/2018/TD-PCBS_SW_CZ.pdf. (software)
Detail

Odpovědnost: Štumpf Martin, doc. Ing., Ph.D.