Detail publikace

Compatibility of through-hole technology devices with low-temperature co-fired ceramic substrate

KLÍMA, M. PSOTA, B. SZENDIUCH, I.

Originální název

Compatibility of through-hole technology devices with low-temperature co-fired ceramic substrate

Typ

článek v časopise - ostatní, Jost

Jazyk

angličtina

Originální abstrakt

The article is focused on usage of the through-hole technology (THT) devices on low-temperature co-fired ceramic (LTCC) substrate. This usage is not common, therefore the main aim of this work is finding out the compatibility between LTCC substrate and a structure of device's lead, solder and thick-film paste. Two arrangements of through-hole metallization were used - printing and hole-filling. The most important results are establishment of reliable assembly process and thermal stress strength for finding the possibility of high temperature application. This is found out by ANSYS software simulation and temperature cycling. Defects caused by temperature cycling were studied optically using micro-cuts.

Klíčová slova

LTCC, THT, device, joint, reliability.

Autoři

KLÍMA, M.; PSOTA, B.; SZENDIUCH, I.

Rok RIV

2013

Vydáno

12. 5. 2013

Místo

Rumunsko

ISSN

2161-2528

Periodikum

Electronics Technology (ISSE)

Ročník

36

Číslo

2013

Stát

Spojené státy americké

Strany od

127

Strany do

131

Strany počet

5

BibTex

@article{BUT102803,
  author="Martin {Klíma} and Boleslav {Psota} and Ivan {Szendiuch}",
  title="Compatibility of through-hole technology devices with low-temperature co-fired ceramic substrate",
  journal="Electronics Technology (ISSE)",
  year="2013",
  volume="36",
  number="2013",
  pages="127--131",
  doi="10.1109/ISSE.2013.6648228",
  issn="2161-2528"
}