Detail publikace

Thermal bridges minimizing through window jamb in low energy buildings

INGELI, R. VAVROVIČ, B. ČEKON, M. PAULOVIČOVÁ, L.

Originální název

Thermal bridges minimizing through window jamb in low energy buildings

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

Building envelopes with high thermal resistance are typical for low-energy buildings. Detailed specification and calculation of each thermal bridge in these buildings should be taken into account. This paper is focused on thermal bridges minimizing through typical window systems in building envelopes. The aim of this article is to analyze the window position influence, as regards on thermal performance and to point out the installation modality in accordance with the characterization of the windows performance. This can be done by quantifying the percentage increment of the window jamb thermal transmittance. The calculated results also demonstrate that there is significant difference between results obtained by various available calculation approaches. This can be significant especially in buildings with high thermal protection.

Klíčová slova

Thermal bridges, thermal losses, linear thermal transmittance, frame, window, jamb

Autoři

INGELI, R.; VAVROVIČ, B.; ČEKON, M.; PAULOVIČOVÁ, L.

Rok RIV

2014

Vydáno

14. 2. 2014

Nakladatel

Trans Tech Publications

Místo

Switzerland

ISBN

978-3-03835-040-8

Kniha

International conference proceedings enviBUILD 13

Číslo edice

1

ISSN

1022-6680

Periodikum

Advanced Materials Research

Ročník

899

Číslo

1

Stát

Švýcarská konfederace

Strany od

66

Strany do

69

Strany počet

4

BibTex

@inproceedings{BUT105690,
  author="Rastislav {Ingeli} and Boris {Vavrovič} and Miroslav {Čekon} and Lucia {Paulovičová}",
  title="Thermal bridges minimizing through window jamb in low energy buildings",
  booktitle="International conference proceedings enviBUILD 13",
  year="2014",
  journal="Advanced Materials Research",
  volume="899",
  number="1",
  pages="66--69",
  publisher="Trans Tech Publications",
  address="Switzerland",
  isbn="978-3-03835-040-8",
  issn="1022-6680"
}