Detail publikace

Temperature Cycling with Peltier Elements of Boards with SMD Components and Failure Evaluation

ŠANDERA, J. NICÁK, M.

Originální název

Temperature Cycling with Peltier Elements of Boards with SMD Components and Failure Evaluation

Typ

článek v časopise ve Web of Science, Jimp

Jazyk

angličtina

Originální abstrakt

This article discusses the construction of a system for temperature cycling, where Peltier elements are used as heating or cooling elements. Thisarticle describes the results and experiences based on several years of practice in the area of thermo-mechanical reliability of soldered joints on printed boards with SMD components.

Klíčová slova

Peltier element, thermal cycling, solder joint reliability

Autoři

ŠANDERA, J.; NICÁK, M.

Rok RIV

2014

Vydáno

21. 3. 2014

Nakladatel

Emerald Group

Místo

England

ISSN

0954-0911

Periodikum

SOLDERING & SURFACE MOUNT TECHNOLOGY

Ročník

26

Číslo

2

Stát

Spojené království Velké Británie a Severního Irska

Strany od

53

Strany do

61

Strany počet

8

URL

http://dx.doi.org/10.1108/SSMT-02-2013-0004

BibTex

@article{BUT106346,
  author="Josef {Šandera} and Michal {Nicák}",
  title="Temperature Cycling with Peltier Elements of Boards with SMD Components and Failure Evaluation",
  journal="SOLDERING & SURFACE MOUNT TECHNOLOGY",
  year="2014",
  volume="26",
  number="2",
  pages="53--61",
  doi="10.1108/SSMT-02-2013-0004",
  issn="0954-0911",
  url="http://dx.doi.org/10.1108/SSMT-02-2013-0004"
}