Detail publikace

SOLDER JOINT FAILURE IDENTIFICATION SYSTEM

VEJMOLA, T. ŠANDERA, J.

Originální název

SOLDER JOINT FAILURE IDENTIFICATION SYSTEM

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

This article deals with defects of the solder joints and their identification. These defects arise in the form of cracks during the thermoelectric cycling. A system capable of identifying these failures and theirs digital process is described below. Moreover, the article defines how to identify errors, the principle of function of the entire system and its parameters. At the end of this article the benefits of this kind of system in practice are described.

Klíčová slova

PC, identification, system, solder, PCB, cycle

Autoři

VEJMOLA, T.; ŠANDERA, J.

Rok RIV

2014

Vydáno

24. 4. 2014

ISBN

978-80-214-4922-0

Kniha

In Proceedings of the 20th conference Student EEICT 2014

Strany od

205

Strany do

208

Strany počet

302

BibTex

@inproceedings{BUT107857,
  author="Tomáš {Vejmola} and Josef {Šandera}",
  title="SOLDER JOINT FAILURE IDENTIFICATION SYSTEM",
  booktitle="In Proceedings of the 20th conference Student EEICT 2014",
  year="2014",
  pages="205--208",
  isbn="978-80-214-4922-0"
}