Přístupnostní navigace
E-přihláška
Vyhledávání Vyhledat Zavřít
Detail publikace
SOMER, J. ŠTEKOVIČ, M. ŠANDERA, J. SZENDIUCH, I.
Originální název
Bonding of LTCC with Alumina ceramics
Typ
článek ve sborníku ve WoS nebo Scopus
Jazyk
angličtina
Originální abstrakt
Low Temperature Co-fired Ceramic (LTCC) is widely used for manufacturing electrical systems in 3D configuration. LTCC substrates were so far bonded with alumina ceramics using additional adhesive layers with subsequent firing or curing cycle. With the advent of the Heraeus zero-shrink LTCC substrates is now possible to bond unfired substrates with other fired substrates; for example fired LTCC or alumina substrates. Alumina substrate in combination with LTCC brings advantages of good thermal conductivity for employing in heating elements or packaging. This paper is focused on description of reliable bonding technique of zero-shrink LTCC and alumina ceramics. Testing structure contains Thick Film pattern for verifying compatibility of the bonding process. For bonding of the substrates were used two methods: Cold Chemical Lamination (CCL) and Thermo-compression method employing dielectric thick film paste as adhesive. Optical method and electric testing of the screen-printed patterns verifies bonding quality.
Klíčová slova
Alumina Ceramics, Bonding, LTCC, Cold Chemical Lamination
Autoři
SOMER, J.; ŠTEKOVIČ, M.; ŠANDERA, J.; SZENDIUCH, I.
Rok RIV
2014
Vydáno
25. 6. 2014
Nakladatel
Vysoké učení technické v Brně
Místo
Brno
ISBN
978-80-214-4985-5
Kniha
Electronic Devices and Systems, IMAPS CS International Conference 2014
Strany od
60
Strany do
64
Strany počet
149
BibTex
@inproceedings{BUT108122, author="Jakub {Somer} and Michal {Štekovič} and Josef {Šandera} and Ivan {Szendiuch}", title="Bonding of LTCC with Alumina ceramics", booktitle="Electronic Devices and Systems, IMAPS CS International Conference 2014", year="2014", pages="60--64", publisher="Vysoké učení technické v Brně", address="Brno", isbn="978-80-214-4985-5" }