Detail publikace

Bonding of LTCC with Alumina ceramics

SOMER, J. ŠTEKOVIČ, M. ŠANDERA, J. SZENDIUCH, I.

Originální název

Bonding of LTCC with Alumina ceramics

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

Low Temperature Co-fired Ceramic (LTCC) is widely used for manufacturing electrical systems in 3D configuration. LTCC substrates were so far bonded with alumina ceramics using additional adhesive layers with subsequent firing or curing cycle. With the advent of the Heraeus zero-shrink LTCC substrates is now possible to bond unfired substrates with other fired substrates; for example fired LTCC or alumina substrates. Alumina substrate in combination with LTCC brings advantages of good thermal conductivity for employing in heating elements or packaging. This paper is focused on description of reliable bonding technique of zero-shrink LTCC and alumina ceramics. Testing structure contains Thick Film pattern for verifying compatibility of the bonding process. For bonding of the substrates were used two methods: Cold Chemical Lamination (CCL) and Thermo-compression method employing dielectric thick film paste as adhesive. Optical method and electric testing of the screen-printed patterns verifies bonding quality.

Klíčová slova

Alumina Ceramics, Bonding, LTCC, Cold Chemical Lamination

Autoři

SOMER, J.; ŠTEKOVIČ, M.; ŠANDERA, J.; SZENDIUCH, I.

Rok RIV

2014

Vydáno

25. 6. 2014

Nakladatel

Vysoké učení technické v Brně

Místo

Brno

ISBN

978-80-214-4985-5

Kniha

Electronic Devices and Systems, IMAPS CS International Conference 2014

Strany od

60

Strany do

64

Strany počet

149

BibTex

@inproceedings{BUT108122,
  author="Jakub {Somer} and Michal {Štekovič} and Josef {Šandera} and Ivan {Szendiuch}",
  title="Bonding of LTCC with Alumina ceramics",
  booktitle="Electronic Devices and Systems, IMAPS CS International Conference 2014",
  year="2014",
  pages="60--64",
  publisher="Vysoké učení technické v Brně",
  address="Brno",
  isbn="978-80-214-4985-5"
}