Detail publikace

Electrochemical Deposition of Tin and Silicon Studied by EQCM

KAVÁLEK, O. VONDRÁK, J. SEDLAŘÍKOVÁ, M.

Originální název

Electrochemical Deposition of Tin and Silicon Studied by EQCM

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

Silicon and Tin thin films were prepared by electrochemical deposition on copper and nickel substrates in the Atmosbag. Electrochemical activity is described by cyclic voltammetry and for studying increase of weight were used EQCM. Deposited layers were studied by optic microscopy, electron microscopy and X-ray diffraction

Klíčová slova

deposition, Tin, Silicon

Autoři

KAVÁLEK, O.; VONDRÁK, J.; SEDLAŘÍKOVÁ, M.

Rok RIV

2014

Vydáno

2. 1. 2014

Nakladatel

ECS

Místo

USA

ISBN

978-1-60768-383-4

Kniha

13th International Conference on Advanced Batteries, Accumulators and Fuel Cells (ABAF)

ISSN

1938-5862

Periodikum

ECS Transactions

Ročník

2014

Číslo

48

Stát

Spojené státy americké

Strany od

17

Strany do

22

Strany počet

6

BibTex

@inproceedings{BUT109057,
  author="Ondřej {Kaválek} and Jiří {Vondrák} and Marie {Sedlaříková}",
  title="Electrochemical Deposition of Tin and Silicon Studied by EQCM",
  booktitle="13th International Conference on Advanced Batteries, Accumulators and Fuel Cells (ABAF)",
  year="2014",
  journal="ECS Transactions",
  volume="2014",
  number="48",
  pages="17--22",
  publisher="ECS",
  address="USA",
  doi="10.1149/04801.0017ecst",
  isbn="978-1-60768-383-4",
  issn="1938-5862"
}