Detail publikace

Mechanical testing of PCB using computer simulations

OTÁHAL, A. SZENDIUCH, I. PSOTA, B.

Originální název

Mechanical testing of PCB using computer simulations

Anglický název

Mechanical testing of PCB using computer simulations

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

čeština

Originální abstrakt

This paper deals with the usage of the computer simulation for the mechanical testing of the PCB's to obtain optimal configuration for mechanical reliability. The main target is to determine factors that are the most important role for this kind of analysis. For this purpose sensitive analysis were made and following critical data were defined. The critical step is to determinate correct material data as well as properties of the board including its attachment.

Anglický abstrakt

This paper deals with the usage of the computer simulation for the mechanical testing of the PCB's to obtain optimal configuration for mechanical reliability. The main target is to determine factors that are the most important role for this kind of analysis. For this purpose sensitive analysis were made and following critical data were defined. The critical step is to determinate correct material data as well as properties of the board including its attachment.

Klíčová slova

circuit reliability, electronic engineering computing, mechanical testing, printed circuit testing

Klíčová slova v angličtině

circuit reliability, electronic engineering computing, mechanical testing, printed circuit testing

Autoři

OTÁHAL, A.; SZENDIUCH, I.; PSOTA, B.

Rok RIV

2014

Vydáno

20. 8. 2014

Nakladatel

IEEE

Místo

Dresden

ISBN

978-1-4799-4455-2

Kniha

37th Int. Spring Seminar on Electronics Technology

Strany od

290

Strany do

293

Strany počet

495

BibTex

@inproceedings{BUT109637,
  author="Alexandr {Otáhal} and Ivan {Szendiuch} and Boleslav {Psota}",
  title="Mechanical testing of PCB using computer simulations",
  booktitle="37th Int. Spring Seminar on Electronics Technology",
  year="2014",
  volume="2014",
  number="37",
  pages="290--293",
  publisher="IEEE",
  address="Dresden",
  doi="10.1109/ISSE.2014.6887610",
  isbn="978-1-4799-4455-2"
}