Detail publikace

FE modelling and analysis of the solder connections for the research project A7.11

ŠEVEČEK, O.

Originální název

FE modelling and analysis of the solder connections for the research project A7.11

Typ

souhrnná výzkumná zpráva - smluv. výzkum

Jazyk

angličtina

Originální abstrakt

FE simulations of the solder connections of electronic parts under different operating and testing boundary conditions (tensile and thermal tests); Investigations of the the critical regions in the solder joint where potential final failure of the joint can occur and subsequent comparision of the simulation results with experimental observations.

Klíčová slova

FE model; solder joint; creep behaviour; tensile test

Autoři

ŠEVEČEK, O.

Vydáno

20. 8. 2014

Strany počet

19

BibTex

@misc{BUT113398,
  author="Oldřich {Ševeček}",
  title="FE modelling and analysis of the solder connections for the research project A7.11",
  year="2014",
  pages="19",
  note="summary research report - contract. research"
}