Detail publikace

2D Modelling of Stresses in Solder Joint Connection

BULVA, J., SZENDIUCH, I.

Originální název

2D Modelling of Stresses in Solder Joint Connection

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

This paper describes thermomechanical modelling of connection of two different materials, which are often used in electronic devices – organics FR4 and two ceramics material Al2O3 and AlN. There are investigated combinations organic-organic, organic-ceramic, ceramic-ceramic, connected with eutectic SnPb solder or lead free solder SnAgCu.

Klíčová slova v angličtině

ANSYS, modelling, solder joint quality

Autoři

BULVA, J., SZENDIUCH, I.

Rok RIV

2004

Vydáno

1. 1. 2004

Nakladatel

Ing. Zdeněk Novotný CSc.,Brno

Místo

Brno

ISBN

80-214-2701-9

Kniha

11th Electronic Devices and Systems Conference 2004 Proceedings

Strany od

377

Strany do

756

Strany počet

380

BibTex

@inproceedings{BUT11421,
  author="Jindřich {Bulva} and Ivan {Szendiuch}",
  title="2D Modelling of Stresses in Solder Joint Connection",
  booktitle="11th Electronic Devices and Systems Conference 2004 Proceedings",
  year="2004",
  pages="380",
  publisher="Ing. Zdeněk Novotný CSc.,Brno",
  address="Brno",
  isbn="80-214-2701-9"
}