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RIHÁK, P.
Originální název
DETECTION OF DEFECT ON FBGA SOLDER BALLS USING X-RAY TECHNOLOGY
Typ
článek ve sborníku ve WoS nebo Scopus
Jazyk
angličtina
Originální abstrakt
The paper deals with the detection of defects using X-ray technology. It is focused on a particular type of X-ray machine, which is used for most of these experiments. X-ray cabinet is commonly used for analyzes of defects, which are formed during soldering process. Paper also includes an introduction of different types of defects. These defects are serious issue and they can cause malfunction of infected components or of the entire device. That is the main reason it is so important to focus on this issue.
Klíčová slova
DPS, BGA, defect, X-ray, detection
Autoři
Rok RIV
2015
Vydáno
23. 4. 2015
Nakladatel
Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních
Místo
Brno
ISBN
978-80-214-5148-3
Kniha
Proceedings of the 21st Conference STUDENT EEICT 2015
Číslo edice
1
ISSN
NEUVEDENO
Strany od
391
Strany do
395
Strany počet
5
BibTex
@inproceedings{BUT114356, author="Pavel {Řihák}", title="DETECTION OF DEFECT ON FBGA SOLDER BALLS USING X-RAY TECHNOLOGY", booktitle="Proceedings of the 21st Conference STUDENT EEICT 2015", year="2015", number="1", pages="391--395", publisher="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních", address="Brno", isbn="978-80-214-5148-3" }