Detail publikace

Bonding of zero-shrink LTCC with alumina ceramics

SOMER, J. ŠTEKOVIČ, M. URBAN, F. ŠANDERA, J. SZENDIUCH, I.

Originální název

Bonding of zero-shrink LTCC with alumina ceramics

Typ

článek v časopise ve Web of Science, Jimp

Jazyk

angličtina

Originální abstrakt

Low Temperature Co-fired Ceramic (LTCC) is widely used for manufacturing electrical systems in 3D configuration. LTCC substrates were so far bonded with alumina ceramics using additional adhesive layers with subsequent firing or curing cycle. With the advent of the zero-shrink LTCC substrates it is now possible to bond unfired substrates with other fired substrates; for example fired LTCC or alumina substrates. Alumina substrate in combination with LTCC brings advantages of good thermal conductivity for usage in heating elements or packaging. This paper is focused on a description of reliable bonding technique of zero-shrink LTCC and alumina ceramics.

Klíčová slova

low temperature co-fired ceramics (LTCC), Alumina Ceramics, thick film pastes, Cold Chemical Lamination

Autoři

SOMER, J.; ŠTEKOVIČ, M.; URBAN, F.; ŠANDERA, J.; SZENDIUCH, I.

Rok RIV

2015

Vydáno

4. 8. 2015

Nakladatel

Emerald Group Publishing Limited

ISSN

0954-0911

Periodikum

SOLDERING & SURFACE MOUNT TECHNOLOGY

Ročník

27

Číslo

4

Stát

Spojené království Velké Británie a Severního Irska

Strany od

157

Strany do

163

Strany počet

7

URL

http://www.emeraldinsight.com/doi/abs/10.1108/SSMT-10-2014-0021

BibTex

@article{BUT115431,
  author="Jakub {Somer} and Michal {Štekovič} and František {Urban} and Josef {Šandera} and Ivan {Szendiuch}",
  title="Bonding of zero-shrink LTCC with alumina ceramics",
  journal="SOLDERING & SURFACE MOUNT TECHNOLOGY",
  year="2015",
  volume="27",
  number="4",
  pages="157--163",
  doi="10.1108/SSMT-10-2014-0021",
  issn="0954-0911",
  url="http://www.emeraldinsight.com/doi/abs/10.1108/SSMT-10-2014-0021"
}