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BOCCACCINI, D. ŠEVEČEK, O. et al.
Originální název
Investigation of the bonding strength and bonding mechanisms of SOFCs interconnector-electrode interfaces
Typ
článek v časopise ve Web of Science, Jimp
Jazyk
angličtina
Originální abstrakt
The determination of the bonding strength (BS) between solid oxide cell (SOC) electrodes and metal interconnects (IC) is of importance since it can impact the SOC lifetime. There are several methods for determining the adhesion between ceramic and metal layers at the macro-scale level, but no standard technique for such measurement is available. In this work, the BSs between an anode support (AS) and three different cathodes with a SOC interconnect were tested in three point bending test configuration. An adaptation of the Schwickerath crack initiation test (SCIT) (ISO 9693) was used to verify its applicability for the determination of bonding strength in the interfaces. The results suggest that this test is a valid method for the mechanical characterization of SOC interfaces.
Klíčová slova
Schwickerath crack-initiation test; three-point bending test; SOC interfaces; metal-ceramic bond strength
Autoři
BOCCACCINI, D.; ŠEVEČEK, O. et al.
Vydáno
1. 1. 2016
Nakladatel
Elsevier
Místo
Holandsko
ISSN
0167-577X
Periodikum
MATERIALS LETTERS
Ročník
2015
Číslo
162
Stát
Nizozemsko
Strany od
250
Strany do
253
Strany počet
4
URL
http://www.sciencedirect.com/science/article/pii/S0167577X15303293
BibTex
@article{BUT116748, author="D. N. {Boccaccini} and Oldřich {Ševeček}", title="Investigation of the bonding strength and bonding mechanisms of SOFCs interconnector-electrode interfaces", journal="MATERIALS LETTERS", year="2016", volume="2015", number="162", pages="250--253", doi="10.1016/j.matlet.2015.07.137", issn="0167-577X", url="http://www.sciencedirect.com/science/article/pii/S0167577X15303293" }