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VALA, R. ŘIHÁK, P. SZENDIUCH, I.
Originální název
Influence of Flux throughout Reflow Process on FBGA Solder Balls
Typ
článek ve sborníku ve WoS nebo Scopus
Jazyk
angličtina
Originální abstrakt
The paper is focused on influence of flux during reflow process. Smaller and lighter FBGA packages caused formation of defects. Analysis of proper soldering process of FBGA components is crucial for correct function of a device. Detection of defects after reflow process is an important part of solder joints reliability. This paper deals with particular parameters which affected yield of FBGA rework process.
Klíčová slova
FBGA, solder alloy, flux, X-Ray.
Autoři
VALA, R.; ŘIHÁK, P.; SZENDIUCH, I.
Rok RIV
2015
Vydáno
6. 5. 2015
Nakladatel
Budapest University of Technology and Economics
Místo
Hungary
ISBN
978-963-313-177-0
Kniha
Novel Trends in Electronic Manufacturing - Book of Abstracts 38th International Spring Seminar on Electronics Technology
Strany od
250
Strany do
254
Strany počet
5
URL
https://ieeexplore.ieee.org/document/7248000
BibTex
@inproceedings{BUT117451, author="Radek {Vala} and Pavel {Řihák} and Ivan {Szendiuch}", title="Influence of Flux throughout Reflow Process on FBGA Solder Balls", booktitle="Novel Trends in Electronic Manufacturing - Book of Abstracts 38th International Spring Seminar on Electronics Technology", year="2015", pages="250--254", publisher="Budapest University of Technology and Economics", address="Hungary", doi="10.1109/ISSE.2015.7248000", isbn="978-963-313-177-0", url="https://ieeexplore.ieee.org/document/7248000" }