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BURŠÍK, M. JANKOVSKÝ, J. ŘEZNÍČEK, M. SZENDIUCH, I. SITKO, V.
Originální název
Innovative procedures for the evaluation method of the efficiency in the cleaning process
Typ
článek ve sborníku ve WoS nebo Scopus
Jazyk
angličtina
Originální abstrakt
High-quality electronic assemblies, especially with “Fine Pitch” components, frequently need an effective but nonetheless environmentally friendly cleaning process. This paper deals with the development of an evaluation method of cleaning processes in microelectronics assembly technology. The elaboration of optimum parameters of the cleaning process for individual applications and the cleaning process efficiency as well as an innovative methodology based on the use of patented test substrates is in detail described in this paper.
Klíčová slova
Cleaning process, microelectronics, environment, high-quality cleaning
Autoři
BURŠÍK, M.; JANKOVSKÝ, J.; ŘEZNÍČEK, M.; SZENDIUCH, I.; SITKO, V.
Rok RIV
2015
Vydáno
6. 5. 2015
Nakladatel
IEEE
Místo
Eger, Hungary
ISBN
978-963-313-177-0
Kniha
Electronics Technology (ISSE), 2015 38th International Spring Seminar
Strany od
288
Strany do
291
Strany počet
5
URL
https://ieeexplore.ieee.org/document/7248007
BibTex
@inproceedings{BUT120002, author="BURŠÍK, M. and JANKOVSKÝ, J. and ŘEZNÍČEK, M. and SZENDIUCH, I. and SITKO, V.", title="Innovative procedures for the evaluation method of the efficiency in the cleaning process", booktitle="Electronics Technology (ISSE), 2015 38th International Spring Seminar", year="2015", pages="288--291", publisher="IEEE", address="Eger, Hungary", doi="10.1109/ISSE.2015.7248007", isbn="978-963-313-177-0", url="https://ieeexplore.ieee.org/document/7248007" }