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SKÁCEL, J. PSOTA, B. SZENDIUCH, I.
Originální název
COMPARISON OF QFN AND BGA CHARACTERISTICS
Typ
článek ve sborníku ve WoS nebo Scopus
Jazyk
angličtina
Originální abstrakt
This paper deals with the issue of packaging and heat transfer in modern microelectronics. Research is focused on the QFN and BGA packages, the most sophisticated conventional solution nowadays. Thermal characteristics are examined through the computer simulations in the program ANSYS Workbench as well as through the experimental measuring. Real measurement is necessary for the verification of the calculated results; afterwards we are able to modify the model to observe the influence of the changes to the package characteristics. Last part is focused on the problem of voids after soldering process in QFN package and comparison of soldering in air and in the desiccator with nitrogen atmosphere with 200ppm residual oxygen. The results are presented through the X-ray inspection of thermal pad.
Klíčová slova
QFN, BGA, ANSYS, thermo-mechanical behavior
Autoři
SKÁCEL, J.; PSOTA, B.; SZENDIUCH, I.
Rok RIV
2015
Vydáno
15. 10. 2015
Nakladatel
Vysoké účení technické v Brně
Místo
BRNO
ISBN
978-80-214-5270-1
Kniha
IMAPS FLASH CONFERENCE 2015
Edice
1
Číslo edice
Strany od
25
Strany do
26
Strany počet
65
BibTex
@inproceedings{BUT120068, author="Josef {Skácel} and Boleslav {Psota} and Ivan {Szendiuch}", title="COMPARISON OF QFN AND BGA CHARACTERISTICS", booktitle="IMAPS FLASH CONFERENCE 2015", year="2015", series="1", number="1", pages="25--26", publisher="Vysoké účení technické v Brně", address="BRNO", isbn="978-80-214-5270-1" }