Detail publikace

CALCULATION AND MEASUREMENT OF THERMOSTATIC BIMETAL DEFLECTION IN MOLDED CASE CIRCUIT BREAKER

Zelenka, M.

Originální název

CALCULATION AND MEASUREMENT OF THERMOSTATIC BIMETAL DEFLECTION IN MOLDED CASE CIRCUIT BREAKER

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

This paper deals with a thermal overload trip unit in automatically operated electrical switching devices. The first part describes an application of thermostatic bimetal in thermal overload trip unit. The main part is devoted to analytical calculation and measurement of specific thermostatic bimetal type contained in thermal trip unit of molded case circuit breaker. It is measurement of deflection depending on temperature change using photoelectric laser sensor. The analytical results are compared with the measured results at the end of the paper.

Klíčová slova

thermostatic bimetal, molded case circuit breaker, measurement

Autoři

Zelenka, M.

Vydáno

29. 4. 2016

Nakladatel

VUT v Brně

Místo

Brno

ISBN

9788021453500

Kniha

Proceedings of the 22nd Conference STUDENT EEICT 2016

Číslo edice

1

Strany od

467

Strany do

471

Strany počet

5

URL

http://www.feec.vutbr.cz/EEICT/2016/sbornik/EEICT-2016-sborn%C3%ADk-komplet.pdf

BibTex

@inproceedings{BUT127471,
  author="Michal {Zelenka}",
  title="CALCULATION AND MEASUREMENT OF THERMOSTATIC BIMETAL DEFLECTION IN MOLDED CASE CIRCUIT  BREAKER",
  booktitle="Proceedings of the 22nd Conference STUDENT EEICT 2016",
  year="2016",
  number="1",
  pages="467--471",
  publisher="VUT v Brně",
  address="Brno",
  isbn="9788021453500",
  url="http://www.feec.vutbr.cz/EEICT/2016/sbornik/EEICT-2016-sborn%C3%ADk-komplet.pdf"
}