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SOBEK, J. FRANTÍK, P. VESELÝ, V.
Originální název
Analytical approximation of crack-tip stress field: Study on efficient determination of coefficients of higher order terms of Williams power expansion
Typ
článek ve sborníku ve WoS nebo Scopus
Jazyk
angličtina
Originální abstrakt
The paper presents a study on accuracy of the multi-parameter approximation of the stress field in a cracked body using Williams power series calibrated according to results of FEM computation. Main attention is paid to a detailed analysis of suitable selection of FE nodes, whose results serve as inputs to the over-deterministic method (ODM) employed for determination of the coefficients of terms of the Williams expansion describing the crack-tip field. Two different ways of FE nodal selection are compared – nodes selected from the crack tip vicinity versus nodes selected from a specific part of the test specimen body in a specific way. Comparison is made with the usage of the authors’ own developed procedures enabling both the determination of the coefficients of the analytical approximation of stress field based on the FE results and the backward reconstruction of the field from those determined terms’ coefficients/functions. The wedge-splitting test (WST) specimen with a crack is taken as example for the study
Klíčová slova
Multi-parameter fracture mechanics, Williams expansion, over-deterministic method
Autoři
SOBEK, J.; FRANTÍK, P.; VESELÝ, V.
Vydáno
18. 8. 2016
Nakladatel
Trans Tech Publications
Místo
Switzerland
ISSN
1013-9826
Periodikum
Key Engineering Materials (print)
Ročník
713
Stát
Švýcarská konfederace
Strany od
207
Strany do
211
Strany počet
5
BibTex
@inproceedings{BUT130323, author="Jakub {Sobek} and Petr {Frantík} and Václav {Veselý}", title="Analytical approximation of crack-tip stress field: Study on efficient determination of coefficients of higher order terms of Williams power expansion", booktitle="Advances in Fracture and Damage Mechanics XV", year="2016", journal="Key Engineering Materials (print)", volume="713", pages="207--211", publisher="Trans Tech Publications", address="Switzerland", doi="10.4028/www.scientific.net/KEM.713.207", issn="1013-9826" }