Detail publikace

INVESTIGATION OF INFLUENCE NITROGEN ATMOSPHERE ON THE SPREADABILITY AND RELIABILITY OF SOLDER JOINTS

VALA, M.

Originální název

INVESTIGATION OF INFLUENCE NITROGEN ATMOSPHERE ON THE SPREADABILITY AND RELIABILITY OF SOLDER JOINTS

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

This article examines the impact of nitrogen atmosphere on the quality of the solder joint. For tests were used two lead-free solder pastes, specifically SAC305 and SN100C. These pastes were printed on a substrate FR4 with ENIG finish with semiautomatic devices. For reflow of paste was used specially modified desiccator. This device has hot plate with the cooling system. This system is active after reflow. In this device, it was possible to create around the solder paste a nitrogen atmosphere having defined content of residual oxygen. This experiment determined the most appropriate concentration of the protective gas atmosphere to obtain the greatest wettability and spreadability of paste, which is a prerequisite for a good solder joint.

Klíčová slova

Solder reflow, nitrogen, modified atmosphere, lead – free, quality of the solder joint, temperature profile.

Autoři

VALA, M.

Vydáno

27. 4. 2017

Nakladatel

Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních

Místo

Brno

ISBN

978-80-214-5496-5

Kniha

Proceedings of the 23nd Conference STUDENT EEICT 2017

Číslo edice

první

Strany od

547

Strany do

551

Strany počet

5

URL

http://eeict.feec.vutbr.cz/?page_id=198

BibTex

@inproceedings{BUT135260,
  author="Martin {Vala}",
  title="INVESTIGATION OF INFLUENCE NITROGEN ATMOSPHERE ON THE SPREADABILITY AND RELIABILITY OF SOLDER JOINTS",
  booktitle="Proceedings of the 23nd Conference STUDENT EEICT 2017",
  year="2017",
  number="první",
  pages="547--551",
  publisher="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních",
  address="Brno",
  isbn="978-80-214-5496-5",
  url="http://eeict.feec.vutbr.cz/?page_id=198"
}