Detail publikace

Lead Free Solder Material Compatibility and Technological Factors

Jiří Starý, Ivan Szendiuch

Originální název

Lead Free Solder Material Compatibility and Technological Factors

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

This paper is focused on wetting and spreading phenomena including investigation of effects and interactions during lead free solder process. There were compared SA and SAC solders with SnPb. Design of experiments (DOE) was used as very useful tool to help in this characteristic study

Klíčová slova v angličtině

lead free, solderability, wettability, surface finish, flux, DOE

Autoři

Jiří Starý, Ivan Szendiuch

Rok RIV

2005

Vydáno

1. 1. 2005

Místo

Vienna

ISBN

0-7803-9325-2

Kniha

Conference Proceedings ISSE 2005

Číslo edice

první

Strany od

78

Strany do

83

Strany počet

6

BibTex

@inproceedings{BUT14428,
  author="Jiří {Starý} and Ivan {Szendiuch}",
  title="Lead Free Solder Material Compatibility and Technological Factors",
  booktitle="Conference Proceedings ISSE 2005",
  year="2005",
  number="první",
  pages="6",
  address="Vienna",
  isbn="0-7803-9325-2"
}