Detail publikace

Application of the Williams Expansion near a Bi-Material Interface

MALÍKOVÁ, L. SEITL, S.

Originální název

Application of the Williams Expansion near a Bi-Material Interface

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

A simplified model of a crack approaching a bi-material interface is modelled by means of the finite element method in order to investigate the significance of the higher-order terms of the Williams expansion for the proper approximation of the opening crack-tip stress near the bi-material interface. The discussion on results is presented and the importance of the higher-order terms proved.

Klíčová slova

Bi-material interface; Crack-tip stress distribution; Finite element; Over-deterministic method; Williams expansion

Autoři

MALÍKOVÁ, L.; SEITL, S.

Vydáno

1. 9. 2017

ISSN

1662-9795

Periodikum

Key Engineering Materials (web)

Ročník

2017

Číslo

754

Stát

Švýcarská konfederace

Strany od

206

Strany do

209

Strany počet

4

BibTex

@inproceedings{BUT146039,
  author="Lucie {Malíková} and Stanislav {Seitl}",
  title="Application of the Williams Expansion near a Bi-Material Interface",
  booktitle="Key Engineering Materials",
  year="2017",
  journal="Key Engineering Materials (web)",
  volume="2017",
  number="754",
  pages="206--209",
  doi="10.4028/www.scientific.net/KEM.754.206",
  issn="1662-9795"
}