Detail publikace

Pulsed EM Plane-Wave Coupling to a Transmission Line Over Orthogonal Ground Planes: An Analytical Model Based on EM Reciprocity

ŠTUMPF, M.

Originální název

Pulsed EM Plane-Wave Coupling to a Transmission Line Over Orthogonal Ground Planes: An Analytical Model Based on EM Reciprocity

Typ

článek v časopise ve Web of Science, Jimp

Jazyk

angličtina

Originální abstrakt

Pulsed electromagnetic field coupling to a transmission line (TL) located over two mutually orthogonal, perfect ground planes is described analytically. It is demonstrated that the effect of an additional ground plane can be readily accounted for by extending the existing formulas applying to the configuration with the single ground plane. The thus obtained closed-form time-domain (TD) formulas specifying the equivalent Thévenin circuits at the terminals of the TL are subsequently applied to calculating the plane-wave induced voltage across a general terminal load. Some special (limiting) cases concerning a relatively short line located close to the conducting reference planes are discussed. The novel analytical results are validated with the help of a three-dimensional computational tool by analyzing the TD response of a thin, conducting planar strip above two mutually orthogonal reference planes.

Klíčová slova

Electromagnetic coupling; electromagnetic interference; transmission line; time-domain analysis; thin strip; thin conducting planes.

Autoři

ŠTUMPF, M.

Vydáno

1. 2. 2021

Nakladatel

IEEE EMC Society

Místo

Hoboken, NJ, USA

ISSN

1558-187X

Periodikum

IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY

Ročník

63

Číslo

1

Stát

Spojené státy americké

Strany od

324

Strany do

327

Strany počet

4

URL

https://ieeexplore.ieee.org/document/9067053

BibTex

@article{BUT164232,
  author="Martin {Štumpf}",
  title="Pulsed EM Plane-Wave Coupling to a Transmission Line Over Orthogonal Ground Planes: An Analytical Model Based on EM Reciprocity",
  journal="IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY",
  year="2021",
  volume="63",
  number="1",
  pages="324--327",
  doi="10.1109/TEMC.2020.2983049",
  issn="1558-187X",
  url="https://ieeexplore.ieee.org/document/9067053"
}