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DOKOUPIL, J. STARÝ, J.
Originální název
Effect of Temperature Cycling on IMC Growth and Solder Joint Strength of SAC305 Solder Alloy and Low Silver Alloy REL61
Typ
článek ve sborníku ve WoS nebo Scopus
Jazyk
angličtina
Originální abstrakt
This work deals with the comparison of the standard SAC305 (Sn 96.5 %; Ag 3 %; Cu 0.5 %) solder alloy with melting temperature between 217 - 220 °C and an alternative alloy REL61 (SnBiAgCu) with lower silver content and melting temperature in the range of 208 - 215 °C in terms of IMC layer growth during thermal cycling and its effect on the shear strength of the solder joints. The test PCBs were soldered using two different temperature profiles and the temperature cycling was performed under two different conditions. No negative effect of REL61 solder alloy on the growth of the IMC layer under thermal stress and on the subsequent shear strength of the solder joint was found. From this point of view, the REL61 solder alloy can be used as a replacement for the SAC305 solder alloy.
Klíčová slova
SAC305; REL61; IMC; temperature cycling; shear strength
Autoři
DOKOUPIL, J.; STARÝ, J.
Vydáno
8. 12. 2021
Nakladatel
ECS - The Electrochemical Society
Místo
Pennington, New Jersey 08534-2839, USA
ISSN
1938-6737
Periodikum
ECS Transaction
Číslo
105
Stát
Spojené státy americké
Strany od
391
Strany do
400
Strany počet
10
BibTex
@inproceedings{BUT175426, author="Jakub {Dokoupil} and Jiří {Starý}", title="Effect of Temperature Cycling on IMC Growth and Solder Joint Strength of SAC305 Solder Alloy and Low Silver Alloy REL61", booktitle="22nd International Conference Advanced Batteries, Accumulators and Fuel Cells", year="2021", series="Volume 105", journal="ECS Transaction", number="105", pages="391--400", publisher="ECS - The Electrochemical Society", address="Pennington, New Jersey 08534-2839, USA", doi="10.1149/10501.0391ecst", issn="1938-6737" }