Detail publikace
An EMI Susceptibility Improved, Wide Temperature Range Bandgap Voltage Reference
KROLÁK, D. HORSKÝ, P.
Originální název
An EMI Susceptibility Improved, Wide Temperature Range Bandgap Voltage Reference
Typ
článek v časopise ve Web of Science, Jimp
Jazyk
angličtina
Originální abstrakt
This article presents a new electromagnetic compatibility improved bandgap voltage reference with a low-current consumption of only 3.2 μA. The reference is designed for automotive applications with an extended temperature range from −50 to 200 °C and a low electromagnetic interference (EMI) susceptibility. The designed reference comes from the well-known Brokaw bandgap topology utilizing only five bipolar junction transistors in a reference core with a collector current leakage compensation. We propose several novel EMI susceptibility improvements of the reference core with a new asymmetrical operational amplifier. Every improvement is discussed in detail and general recommendations, on how to decrease the bandgap EMI susceptibility, are presented. Simulation results are compared with measurements on a system on chip. Measurement results show dc voltage variation below 0.5% for 5 mW (7 dBm) supply EMI over the frequency range from 100 kHz to 1 GHz.
Klíčová slova
Bandgap voltage reference, Brokaw bandgap voltage reference, bandgap reference, electromagnetic compatibility, electromagnetic interference, integrated circuit, voltage reference
Autoři
KROLÁK, D.; HORSKÝ, P.
Vydáno
16. 4. 2024
Nakladatel
IEEE
Místo
Piscataway, USA
ISSN
1558-187X
Periodikum
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY
Ročník
1
Číslo
1
Stát
Spojené státy americké
Strany od
1
Strany do
8
Strany počet
8
URL
BibTex
@article{BUT177757,
author="David {Krolák} and Pavel {Horský}",
title="An EMI Susceptibility Improved, Wide Temperature Range Bandgap Voltage Reference",
journal="IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY",
year="2024",
volume="1",
number="1",
pages="1--8",
doi="10.1109/TEMC.2024.3381816",
issn="1558-187X",
url="https://ieeexplore.ieee.org/document/10502225"
}