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Detail publikace
FAHRBACH, M. JIUSHAI, X. KLAPETEK, P. MARTINEK, J. PEINER, E.
Originální název
Contact Resonance Imaging with Vertical Nanowire Arrays
Typ
článek ve sborníku ve WoS nebo Scopus
Jazyk
angličtina
Originální abstrakt
A setup for high-throughput measurement of dimensional and mechanical parameters of silicon microwire and resist microwire arrays is used for combined topography and contact resonance imaging. It is based on customized long slander piezoresistive silicon microprobes designed for in-line measurements of industrial workpieces. In measurements with microwire and nanowire arrays we found sub-micrometer resolution on large areas (300umx300um) at high speed up to 300 um/s. Using a mass-spring model, characteristic features of contact resonance imaging with slender microprobes were simulated.
Klíčová slova
modal analysis, finite element method, ultrasonic testing, fundamental frequency
Autoři
FAHRBACH, M.; JIUSHAI, X.; KLAPETEK, P.; MARTINEK, J.; PEINER, E.
Vydáno
11. 5. 2022
Nakladatel
AMA Service GmbH
Místo
Nuremberg
ISBN
9783800758364
Kniha
Sensoren und Messsysteme - 21. ITG/GMA Fachtagung
Edice
1.
Strany od
245
Strany do
250
Strany počet
6
BibTex
@inproceedings{BUT182522, author="Michael {Fahrbach} and xu {jiushai} and Petr {Klapetek} and Jan {Martinek} and Erwin {Peiner}", title="Contact Resonance Imaging with Vertical Nanowire Arrays", booktitle="Sensoren und Messsysteme - 21. ITG/GMA Fachtagung", year="2022", series="1.", pages="245--250", publisher="AMA Service GmbH", address="Nuremberg", isbn="9783800758364" }