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PRŮCHA, A. ŠLANHOF, J. NEČASOVÁ, B.
Originální název
Size effect of bonded area for bonded joints between ETICS with an acrylic thin-film plaster and sheet metal component
Typ
článek ve sborníku ve WoS nebo Scopus
Jazyk
angličtina
Originální abstrakt
The issue of anchoring sheet metal components has been part of construction practice for a very long time. Sheet metal components can be found on most contemporary buildings and due to the increasing thickness of insulation the possibility of anchoring to the supporting substrate is a problem. This paper discusses the issue of the bonded joint size dependence on the load capacity for fastening sheet metal elements to ETICS facades. A thixotropic silane modified polymer adhesive was used for this research. It was concluded that the size has a significant effect on the load capacity of the joint and their dependence was described.
Klíčová slova
adhesive, joint, facade, sheet metal components, thin-layer plaster
Autoři
PRŮCHA, A.; ŠLANHOF, J.; NEČASOVÁ, B.
Vydáno
30. 10. 2023
Nakladatel
EDP Sciences
ISSN
2261-236X
Periodikum
MATEC Web of Conferences
Ročník
385
Stát
Francouzská republika
Strany od
1
Strany do
5
Strany počet
URL
https://www.matec-conferences.org/articles/matecconf/abs/2023/12/matecconf_ys2023_01039/matecconf_ys2023_01039.html
Plný text v Digitální knihovně
http://hdl.handle.net/11012/245080
BibTex
@inproceedings{BUT185058, author="Aleš {Průcha} and Barbora {Nečasová} and Jiří {Šlanhof}", title="Size effect of bonded area for bonded joints between ETICS with an acrylic thin-film plaster and sheet metal component", booktitle="MATEC Web Conf. Volume 385, 2023, The 15th International Scientific Conference of Civil and Environmental Engineering for the PhD. Students and Young Scientists – Young Scientist 2023", year="2023", journal="MATEC Web of Conferences", volume="385", pages="5", publisher="EDP Sciences", doi="10.1051/matecconf/202338501039", issn="2261-236X", url="https://www.matec-conferences.org/articles/matecconf/abs/2023/12/matecconf_ys2023_01039/matecconf_ys2023_01039.html" }