Detail publikace

Investigation of solder joints strength

Cyril Vasko, Jiri Ohera, Ivan Szendiuch

Originální název

Investigation of solder joints strength

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

This paper deals with method for finding mechanical properties of solder joint. Basic aim is practical realization one’s select method namely shear strength finish of solder joint and their thermal fatigue variants on ceramic substrate. The test is execution on testing components soldered by tin-lead and lead-free solder. Acquired characteristic can subserve to definition influencing factors of strength and reliability soldered joint on ceramic substrate, primarily soldered by lead-free solder.

Klíčová slova

solder joints, strength, shear stress, lead-free

Autoři

Cyril Vasko, Jiri Ohera, Ivan Szendiuch

Rok RIV

2006

Vydáno

1. 5. 2006

Nakladatel

TU Dresden

Místo

Dresden

ISBN

3-934142-23-0

Kniha

ISSE 2006 Proceeding

Číslo edice

1

Strany od

123

Strany do

126

Strany počet

4

BibTex

@inproceedings{BUT18549,
  author="Cyril {Vaško} and Ivan {Szendiuch}",
  title="Investigation of solder joints strength",
  booktitle="ISSE 2006 Proceeding",
  year="2006",
  number="1",
  pages="4",
  publisher="TU Dresden",
  address="Dresden",
  isbn="3-934142-23-0"
}