Detail publikace
Reliability of solar cell´s solder joints
Jakubka,L., Novotny,M., Hladik,J., Szendiuch,I.
Originální název
Reliability of solar cell´s solder joints
Typ
článek ve sborníku ve WoS nebo Scopus
Jazyk
angličtina
Originální abstrakt
This work is about reliability of solar cell´s solder joints. Ceramic substrate and back side contact solar cells were used. The Ag paste was used as a conductive layer and lead free solder paste was chosen as a solder. 3 firing profiles in 4-zone furnace were tested. The thermal cycling is the next step. In the end of this work is the simulation in ANSYS.
Klíčová slova v angličtině
Reliability, Interconnection, Back Side Contact Solar Cell, ANSYS
Autoři
Jakubka,L., Novotny,M., Hladik,J., Szendiuch,I.
Rok RIV
2006
Vydáno
1. 1. 2006
Nakladatel
Heinz Wohlrabe
Místo
Dresden
ISBN
3-934142-23-0
Kniha
Proceeding of ISSE 2006
Číslo edice
první
Strany od
72
Strany do
76
Strany počet
5
BibTex
@inproceedings{BUT18687,
author="Luboš {Jakubka} and Marek {Novotný} and Jiří {Hladík} and Ivan {Szendiuch}",
title="Reliability of solar cell´s solder joints",
booktitle="Proceeding of ISSE 2006",
year="2006",
number="první",
pages="5",
publisher="Heinz Wohlrabe",
address="Dresden",
isbn="3-934142-23-0"
}