Detail publikace

Preparation and Deployment of Secure Over-The-Air Updates for Embedded Devices: Challenges and Solutions

PALUŘÍK, P. MIKULÁŠEK, M. JABLONČÍK, L.

Originální název

Preparation and Deployment of Secure Over-The-Air Updates for Embedded Devices: Challenges and Solutions

Typ

článek v časopise - ostatní, Jost

Jazyk

angličtina

Originální abstrakt

This paper provides a comprehensive overview of the preparation and deployment of secure Over-The-Air (OTA) updates for embedded devices. In the era of intelligent devices, the need for remotely updating software and firmware has become increasingly prevalent. This paper discusses the principles of OTA updates, focusing on the various types used in the field of embedded devices and the complications that need to be resolved for a successful process. Furthermore, it delves into the theoretical description of OTA updates, security mechanisms, and practical implementation. The paper also highlights the main benefits of OTA updates, such as convenience, security, scalability, reduced maintenance costs, and improved performance. Additionally, it addresses the challenges and issues associated with OTA updates, including update reliability, security risks, compatibility, network propagation, and integrity and warranty implications. Overall, this paper serves as a valuable resource for understanding the complexities and importance of OTA updates in the realm of embedded devices.

Klíčová slova

application, esp32, ota, security, update, wireless

Autoři

PALUŘÍK, P.; MIKULÁŠEK, M.; JABLONČÍK, L.

Vydáno

26. 6. 2024

Nakladatel

SCIENTIFIC TECHNICAL UNION OF MECHANICAL ENGINEERING INDUSTRY - 4.0

Místo

Sofia, Bulgaria

ISSN

2534-8582

Periodikum

Industry 4.0

Ročník

9

Číslo

3

Stát

Bulharská republika

Strany od

23

Strany do

27

Strany počet

35

URL

https://stumejournals.com/i4.htm

BibTex

@article{BUT189341,
  author="Pavel {Paluřík} and Michal {Mikulášek} and Lukáš {Jablončík}",
  title="Preparation and Deployment of Secure Over-The-Air Updates for Embedded Devices: Challenges and Solutions",
  journal="Industry 4.0",
  year="2024",
  volume="9",
  number="3",
  pages="23--27",
  issn="2534-8582",
  url="https://stumejournals.com/i4.htm"
}