Detail publikace

Realization and Simulation of Interconnection of Solar Cell

Jakubka,L., Novotny,M., Szendiuch,I.

Originální název

Realization and Simulation of Interconnection of Solar Cell

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

This work is about interconnection of the solar cell and the substrate. Ceramic substrate and back side contact solar cells were used. The Ag paste was used as a conductive layer and lead free solder paste was chosen as a solder. 3 firing profiles in 4-zone furnace were tested. The thermal cycling is the next step. In the end of this work is the simulation in ANSYS.

Klíčová slova v angličtině

Interconnection, Back Side Contact Solar Cell, Reliability, ANSYS

Autoři

Jakubka,L., Novotny,M., Szendiuch,I.

Rok RIV

2006

Vydáno

1. 1. 2006

Nakladatel

Prof. Vítězslav Benda, PhD.

Místo

Praha

ISBN

80-01-03467-4

Kniha

3rd INTERNATIONAL WORKSHOP ON TEACHING IN PHOTOVOLTAIC, IWTPV´06 PROCEEDINGS

Číslo edice

první

Strany od

119

Strany do

122

Strany počet

4

BibTex

@inproceedings{BUT21051,
  author="Luboš {Jakubka} and Marek {Novotný} and Ivan {Szendiuch}",
  title="Realization and Simulation of Interconnection of Solar Cell",
  booktitle="3rd INTERNATIONAL WORKSHOP ON TEACHING IN PHOTOVOLTAIC, IWTPV´06 PROCEEDINGS",
  year="2006",
  number="první",
  pages="4",
  publisher="Prof. Vítězslav Benda, PhD.",
  address="Praha",
  isbn="80-01-03467-4"
}