Detail publikace

Thermomechanical Reliability of Lead-Free Solder Joint in SMT Assembly

ŠANDERA, J.

Originální název

Thermomechanical Reliability of Lead-Free Solder Joint in SMT Assembly

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

It focuse practical measurement of the reliability of the LF solder connection SMT mounted components on PCB. A Special PCBs with various footprints and surface design were realized

Klíčová slova

reliability of solder joint, footprint, surface finishing, crack

Autoři

ŠANDERA, J.

Rok RIV

2007

Vydáno

9. 5. 2007

Nakladatel

EDITURA MEDIAMIRA str. Horea nr. 47-49/1 400275 Cluj-Napoca C.P. 117,O.P. 1

Místo

Cluj-Napoca, Romania

ISBN

978-973-713-174-4

Kniha

ISSE 2007, 30th. International Spring Seminar on Electronics Technology, Abstracts Proceedings

Číslo edice

1. vydání

Strany od

76

Strany do

77

Strany počet

2

BibTex

@inproceedings{BUT22777,
  author="Josef {Šandera}",
  title="Thermomechanical Reliability of Lead-Free Solder Joint in SMT Assembly",
  booktitle="ISSE 2007, 30th. International Spring Seminar on Electronics Technology, Abstracts Proceedings",
  year="2007",
  number="1. vydání",
  pages="76--77",
  publisher="EDITURA  MEDIAMIRA str. Horea nr. 47-49/1 400275 Cluj-Napoca C.P. 117,O.P. 1",
  address="Cluj-Napoca, Romania",
  isbn="978-973-713-174-4"
}