Detail publikace

Thick Film Resistor Testing by Electro - Ultrasonic Spectroscopy with DC Electric Signal

TOFEL, P. SEDLÁKOVÁ, V. ŠIKULA, J.

Originální název

Thick Film Resistor Testing by Electro - Ultrasonic Spectroscopy with DC Electric Signal

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

The new method of non-destructive testing of the thick film resistors is presented. There are two phenomena which lead to the resistance modulation: (i) The interaction of the charge carriers with phonons, (ii) The ultrasonic signal changes the contact area between the conducting grains in the resistor structure. Ultrasound-excited resistance change in polymer based thick film structures is about 0.005 to 1 , which corresponds to the relative resistance change of the order from 10-6. We suppose that the resistive structures with defects are more influenced by the ultrasonic vibrations. The intermodulation signal can be used as the quality and reliability indicator

Klíčová slova

Elektro-Ultrasonic, rezistive change, DC voltage

Autoři

TOFEL, P.; SEDLÁKOVÁ, V.; ŠIKULA, J.

Rok RIV

2008

Vydáno

7. 5. 2008

Místo

Hungary

ISBN

978-963-06-4915-5

Kniha

Reliability and Life-time Prediction ISSE2008

Edice

1

Číslo edice

1

Strany od

56

Strany do

57

Strany počet

2

BibTex

@inproceedings{BUT26554,
  author="Pavel {Tofel} and Vlasta {Sedláková} and Josef {Šikula}",
  title="Thick Film Resistor Testing by Electro - Ultrasonic Spectroscopy with DC Electric Signal",
  booktitle="Reliability and Life-time Prediction ISSE2008",
  year="2008",
  series="1",
  number="1",
  pages="56--57",
  address="Hungary",
  isbn="978-963-06-4915-5"
}