Detail publikace
Thick Film Resistor Testing by Electro - Ultrasonic Spectroscopy with DC Electric Signal
TOFEL, P. SEDLÁKOVÁ, V. ŠIKULA, J.
Originální název
Thick Film Resistor Testing by Electro - Ultrasonic Spectroscopy with DC Electric Signal
Typ
článek ve sborníku ve WoS nebo Scopus
Jazyk
angličtina
Originální abstrakt
The new method of non-destructive testing of the thick film resistors is presented. There are two phenomena which lead to the resistance modulation: (i) The interaction of the charge carriers with phonons, (ii) The ultrasonic signal changes the contact area between the conducting grains in the resistor structure. Ultrasound-excited resistance change in polymer based thick film structures is about 0.005 to 1 , which corresponds to the relative resistance change of the order from 10-6. We suppose that the resistive structures with defects are more influenced by the ultrasonic vibrations. The intermodulation signal can be used as the quality and reliability indicator
Klíčová slova
Elektro-Ultrasonic, rezistive change, DC voltage
Autoři
TOFEL, P.; SEDLÁKOVÁ, V.; ŠIKULA, J.
Rok RIV
2008
Vydáno
7. 5. 2008
Místo
Hungary
ISBN
978-963-06-4915-5
Kniha
Reliability and Life-time Prediction ISSE2008
Edice
1
Číslo edice
1
Strany od
56
Strany do
57
Strany počet
2
BibTex
@inproceedings{BUT26554,
author="Pavel {Tofel} and Vlasta {Sedláková} and Josef {Šikula}",
title="Thick Film Resistor Testing by Electro - Ultrasonic Spectroscopy with DC Electric Signal",
booktitle="Reliability and Life-time Prediction ISSE2008",
year="2008",
series="1",
number="1",
pages="56--57",
address="Hungary",
isbn="978-963-06-4915-5"
}