Detail publikace

DEVELOPMENT OF LEAD-FREE SOLDERED 3D STRUCTURES

NICÁK, M.

Originální název

DEVELOPMENT OF LEAD-FREE SOLDERED 3D STRUCTURES

Anglický název

DEVELOPMENT OF LEAD-FREE SOLDERED 3D STRUCTURES

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

čeština

Originální abstrakt

This paper describes design, construction and some test results of lead-free soldered three-dimensional structures based on combination of stacked thick-film Al2O3 or LTCC and FR-4 substrates.

Anglický abstrakt

This paper describes design, construction and some test results of lead-free soldered three-dimensional structures based on combination of stacked thick-film Al2O3 or LTCC and FR-4 substrates.

Klíčová slova

AL2O3, LTCC, FR-4, 3D, Lead-free

Autoři

NICÁK, M.

Rok RIV

2010

Vydáno

29. 4. 2010

Nakladatel

NOVPRESS

Místo

Brno

ISBN

978-80-214-4079-1

Kniha

STUDENT EEICT 2010

Edice

1

Číslo edice

1

Strany od

231

Strany do

235

Strany počet

5

URL

http://www.feec.vutbr.cz/EEICT/2010/sbornik/03-Doktorske_projekty/06-Mikroelektronika_a_technologie/12-xmeda.pdf

BibTex

@inproceedings{BUT30818,
  author="Michal {Nicák}",
  title="DEVELOPMENT OF LEAD-FREE SOLDERED 3D STRUCTURES",
  booktitle="STUDENT EEICT 2010",
  year="2010",
  series="1",
  number="1",
  pages="231--235",
  publisher="NOVPRESS",
  address="Brno",
  isbn="978-80-214-4079-1",
  url="http://www.feec.vutbr.cz/EEICT/2010/sbornik/03-Doktorske_projekty/06-Mikroelektronika_a_technologie/12-xmeda.pdf"
}