Detail publikace

Stability of Microstructure of UFG Copper after Fatigue Loading and Thermal Exposition

NAVRÁTILOVÁ, L. PANTĚLEJEV, L. MAN, O. KUNZ, L.

Originální název

Stability of Microstructure of UFG Copper after Fatigue Loading and Thermal Exposition

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

The objective of the present work was to study the stability of microstructure of ultra fine-grained (UFG) copper under high-cycle and very high-cycle fatigue loading and under thermal exposition. UFG Cu was prepared by equal channel angular pressing. No grain coarsening was observed after fatigue resulting in failure in the interval from 104 to 1010 cycles. Similarly, no grain coarsening was detected after thermal exposition at a temperature of 180 C for 6 min. The microstructure was examined by electron backscattering diffraction (EBSD) and transmission electron microscopy (TEM)

Klíčová slova

UFG copper, ECAP, stability of microstructure, EBSD

Autoři

NAVRÁTILOVÁ, L.; PANTĚLEJEV, L.; MAN, O.; KUNZ, L.

Rok RIV

2009

Vydáno

22. 6. 2009

Nakladatel

University of Žilina

Místo

Žilina, Sk

ISBN

978-80-554-0042-6

Kniha

Proceedings Transcom 2009

Edice

Section 5

Číslo edice

1

Strany od

149

Strany do

154

Strany počet

6

BibTex

@inproceedings{BUT33240,
  author="Lucie {Navrátilová} and Libor {Pantělejev} and Ondřej {Man} and Ludvík {Kunz}",
  title="Stability of Microstructure of UFG Copper after Fatigue Loading and Thermal Exposition",
  booktitle="Proceedings Transcom 2009",
  year="2009",
  series="Section 5",
  number="1",
  pages="149--154",
  publisher="University of Žilina",
  address="Žilina, Sk",
  isbn="978-80-554-0042-6"
}