Detail publikace

New Facts from Lead-free Solders Reliability Investigation

BURŠÍK, M. SZENDIUCH, I. JANKOVSKÝ, J. HEJÁTKOVÁ, E.

Originální název

New Facts from Lead-free Solders Reliability Investigation

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

The aim is to investigate some factors which influencing solder joint reliability and voids restriction, especially by reflow soldering process. The core factor for prediction and evaluation of solder joint reliability is solder joint structure.

Klíčová slova

Lead-free, reliability, solder, structure

Autoři

BURŠÍK, M.; SZENDIUCH, I.; JANKOVSKÝ, J.; HEJÁTKOVÁ, E.

Rok RIV

2010

Vydáno

13. 9. 2010

Místo

Berlín, Německo

ISBN

978-1-4244-8555-0

Kniha

Electronics System Integration Technology Conference ESTC 2010 in Berlin

Edice

1

Číslo edice

1

Strany od

101

Strany do

105

Strany počet

5

BibTex

@inproceedings{BUT35244,
  author="Martin {Buršík} and Ivan {Szendiuch} and Jaroslav {Jankovský} and Edita {Hejátková}",
  title="New Facts from Lead-free Solders Reliability Investigation",
  booktitle="Electronics System Integration Technology Conference ESTC 2010 in Berlin",
  year="2010",
  series="1",
  number="1",
  pages="101--105",
  address="Berlín, Německo",
  isbn="978-1-4244-8555-0"
}