Detail publikace

Contribution to realization of 3D structures

NICÁK, M. ŠANDERA, J. SZENDIUCH, I.

Originální název

Contribution to realization of 3D structures

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

This paper describes design, construction and some recent test results of lead-free soldered three-dimensional structures based on combination of stacked thick-film Al2O3 or LTCC and FR-4 substrates. These various substrate configurations are realized in two ways, at first by lead-free solder bumps made by solder paste stencil printing, and at second by bumps using combination of paste and solder balls. This three dimensional technology offers great potential to very compact embedded structures which may include as hybrid integrated circuits (HIC) well as non-conventional applications (sensors, attenuators etc).

Klíčová slova

3D, stacked, AL2O3, LTCC

Autoři

NICÁK, M.; ŠANDERA, J.; SZENDIUCH, I.

Rok RIV

2010

Vydáno

12. 8. 2010

Nakladatel

IEEE Xplore digital library

Místo

Warsaw, Poland

ISBN

978-1-4244-7849-1

Kniha

33rd International Spring Seminar on Electronics Technology (ISSE), 2010

Strany od

156

Strany do

159

Strany počet

3

URL

http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=5547280&tag=1

BibTex

@inproceedings{BUT35869,
  author="Michal {Nicák} and Josef {Šandera} and Ivan {Szendiuch}",
  title="Contribution to realization of 3D structures",
  booktitle="33rd International Spring Seminar on Electronics Technology (ISSE), 2010",
  year="2010",
  pages="156--159",
  publisher="IEEE Xplore digital library",
  address="Warsaw, Poland",
  isbn="978-1-4244-7849-1",
  url="http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=5547280&tag=1"
}