Detail publikace

Vapour deposition on LTCC for 3D structure

KOSINA, P. HEJÁTKOVÁ, E. ŠANDERA, J.

Originální název

Vapour deposition on LTCC for 3D structure

Typ

článek v časopise - ostatní, Jost

Jazyk

angličtina

Originální abstrakt

Paper deals with an area of thin film layers made for LTCC interconnections. The thin layers were realized using physical vapour deposition (thin film technology). Cooper and silver were used for deposition. Cooper thin film layer properties were affected adversely by sintering but the silver thin film layer was unaffected without any change of parameters. The deposited thin film layers on the LTCC substrate were tested for reliability using current loading. The possibility of deposited layers ultrasonic wire bonding and interconnection were tested and discussed too.

Klíčová slova

LTCC, thin film, thick film, 3D structure

Autoři

KOSINA, P.; HEJÁTKOVÁ, E.; ŠANDERA, J.

Rok RIV

2008

Vydáno

24. 9. 2008

Nakladatel

TU - Sofia

Místo

Sozopol, Bulgaria

ISSN

1313-1842

Periodikum

Electronics

Ročník

2008

Číslo

1

Stát

Bulharská republika

Strany od

115

Strany do

120

Strany počet

6

BibTex

@article{BUT47201,
  author="Petr {Kosina} and Edita {Hejátková} and Josef {Šandera}",
  title="Vapour deposition on LTCC for 3D structure",
  journal="Electronics",
  year="2008",
  volume="2008",
  number="1",
  pages="115--120",
  issn="1313-1842"
}