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Detail publikace
TRIVEDI, R. ČECH, V.
Originální název
Mechanical properties of plasma polymer film evaluated by conventional and alternative nanoindentation techniques
Typ
abstrakt
Jazyk
angličtina
Originální abstrakt
A plasma-polymerized tetravinylsilane film of about 1 micron thickness was prepared under steady-state deposition conditions on polished silicon wafer using plasma-enhanced chemical vapor deposition. Near-surface mechanical properties such as the reduced modulus and hardness of the plasma polymer film were investigated using the conventional depth-sensing nanoindentation technique as well as the load-partial-unload (cyclic) nanoindentation technique. The study found an influence of the dwell time and loading/unloading rate on the determined values of the reduced modulus, hardness, and contact depth.
Klíčová slova
plasma polymerization; thin films; nanoindentation
Autoři
TRIVEDI, R.; ČECH, V.
Vydáno
22. 12. 2009
Strany od
1
Strany do
Strany počet
BibTex
@misc{BUT60907, author="Rutul Rajendra {Trivedi} and Vladimír {Čech}", title="Mechanical properties of plasma polymer film evaluated by conventional and alternative nanoindentation techniques", booktitle="Book of Abstracts, 7th AEPSE 2009, Busan", year="2009", pages="1--1", note="abstract" }