Detail publikace

On the Application of 3D LTCC and Flexible Structures Based on Galvanized Layers

NICÁK, M. ŠANDERA, J.

Originální název

On the Application of 3D LTCC and Flexible Structures Based on Galvanized Layers

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

This paper describes design, construction and some recent tests of three dimensional stacked structures. These structures have great potential to realize compact structures combining multiple different applications in one package. Interconnections used in these structures pay important role in packaging. They not only provide electrical connection, but they also act as mechanical attachment between substrates and are supposed to be reliable. Approach mentioned in this paper might lead to increase of reliability of 3D interconnections. Goal of this work is development and implementation of reliable 3D stacked structures, where LTCC, Al2O3 and also flexible substrates can be connected together in one package by interconnections that are based on vacuum evaporated and galvanically reinforced conductive layers of several types - fixed planar and elastic ones, both in connection with solder balls.

Klíčová slova

3D structures, LTCC, vacuum evaporation, galvanic processes

Autoři

NICÁK, M.; ŠANDERA, J.

Rok RIV

2011

Vydáno

11. 5. 2011

Nakladatel

Technická Univerzita Košice

Místo

Košice, SK

ISBN

978-1-4577-2111-3

Kniha

ISSE 2011 - PROCEEDINGS

Edice

1.

Číslo edice

1

ISSN

2161-2528

Periodikum

Electronics Technology (ISSE)

Ročník

34

Stát

Spojené státy americké

Strany od

109

Strany do

111

Strany počet

3

URL

http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6053560

BibTex

@inproceedings{BUT73390,
  author="Michal {Nicák} and Josef {Šandera}",
  title="On the Application of 3D LTCC and Flexible Structures Based on Galvanized Layers",
  booktitle="ISSE 2011 - PROCEEDINGS",
  year="2011",
  series="1.",
  journal="Electronics Technology (ISSE)",
  volume="34",
  number="1",
  pages="109--111",
  publisher="Technická Univerzita Košice",
  address="Košice, SK",
  isbn="978-1-4577-2111-3",
  issn="2161-2528",
  url="http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6053560"
}