Detail publikace

Recent advance in solder ball interconnections reliability examination

ŠVECOVÁ, O. NICÁK, M. ŠANDERA, J. KOSINA, P.

Originální název

Recent advance in solder ball interconnections reliability examination

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

This article describes recent advance in research of reliability of lead-free (SAC 305) ball interconnections between electronic modules and base printed circuit boards. Alternative methods such as finite element method, which is being widely used in simulation software Ansys and by Coffin-Manson's fatigue model. Recent calculations concur to statistic-based evaluation of earlier experiments, which proved greater reliability of solder joints created on alumina substrates.

Klíčová slova

Lead-free solder, solder joint, reliability and fatigue models

Autoři

ŠVECOVÁ, O.; NICÁK, M.; ŠANDERA, J.; KOSINA, P.

Rok RIV

2011

Vydáno

11. 5. 2011

Nakladatel

Technická Univerzita Košice

Místo

Košice, SK

ISBN

978-1-4577-2111-3

Kniha

ISSE 2011 - PROCEEDINGS

Edice

1.

Číslo edice

1

ISSN

2161-2528

Periodikum

Electronics Technology (ISSE)

Stát

Spojené státy americké

Strany od

253

Strany do

257

Strany počet

4

URL

http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6053560

BibTex

@inproceedings{BUT74392,
  author="Olga {Švecová} and Michal {Nicák} and Josef {Šandera} and Petr {Kosina}",
  title="Recent advance in solder ball interconnections reliability examination",
  booktitle="ISSE 2011 - PROCEEDINGS",
  year="2011",
  series="1.",
  journal="Electronics Technology (ISSE)",
  number="1",
  pages="253--257",
  publisher="Technická Univerzita Košice",
  address="Košice, SK",
  isbn="978-1-4577-2111-3",
  issn="2161-2528",
  url="http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6053560"
}