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ČECH, V. HOSEIN, H.-A. LASOTA, T. DRZAL, L.
Originální název
Mechanical properties of plasma-polymerized tetravinylsilane films
Typ
článek v časopise - ostatní, Jost
Jazyk
angličtina
Originální abstrakt
Continuous stiffness measurement (CSM) and dynamic contact module (DCM) nanoindentation measurements were used to characterize the mechanical properties of plasma-polymerized tetravinylsilane films deposited by PECVD at RF powers ranging from 10 to 70 W. The Youngs modulus and hardness as a function of the indenter displacement (5-500 nm) were investigated for films of 1-micron thickness. The Youngs modulus (hardness) was observed to increase from 8.3 GPa (0.9 GPa) to 58 GPa (9.5 GPa) with enhanced RF power. Nanoindentation analysis together with AFM imaging revealed a grain character of films deposited at a higher power. Finite element analysis was used to simulate nanoindentation measurements and evaluate properties of the elastic-plastic material.
Klíčová slova
mechanical properties; nanoindentation; organosilicon precursors; plasma-enhanced chemical vapor deposition (PECVD); thin films
Autoři
ČECH, V.; HOSEIN, H.-A.; LASOTA, T.; DRZAL, L.
Rok RIV
2011
Vydáno
31. 12. 2011
ISSN
1612-8850
Periodikum
Plasma Processes and Polymers
Ročník
8
Číslo
2
Stát
Spolková republika Německo
Strany od
138
Strany do
146
Strany počet
9
BibTex
@article{BUT89392, author="ČECH, V. and HOSEIN, H.-A. and LASOTA, T. and DRZAL, L.", title="Mechanical properties of plasma-polymerized tetravinylsilane films", journal="Plasma Processes and Polymers", year="2011", volume="8", number="2", pages="138--146", issn="1612-8850" }