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TRIVEDI, R. HOFEREK, L. ČECH, V.
Originální název
Depth profile of mechanical properties of plasma-polymerized tetravinylsilane films evaluated by cyclic nanoindentation
Typ
článek v časopise - ostatní, Jost
Jazyk
angličtina
Originální abstrakt
Plasma-polymerized tetravinylsilane films deposited on silicon wafers by PECVD at different powers using pulsed plasma were analyzed by both typical conventional depth sensing and by cyclic nanoindentation. A comparative study of the two methods was carried out under reduced system drift. It was found that cyclic nanoindentation is a reproducible technique enabling reliable construction of the depth profile of mechanical properties to the same degree of accuracy as conventional nanoindentation but considerably faster. The Youngs modulus (7.9-17 GPa) and hardness (0.69-3.0 GPa) of films were controlled by the effective power (0.1-10 W). Conditions for appropriate depth analysis of mechanical properties at shallow depth and the limited applicability of the 10% rule are also discussed.
Klíčová slova
Thin film, plasma polymerization, nanoindentation, Youngs modulus, hardness
Autoři
TRIVEDI, R.; HOFEREK, L.; ČECH, V.
Rok RIV
2011
Vydáno
31. 12. 2011
ISSN
0257-8972
Periodikum
Surface and Coatings Technology
Ročník
205
Číslo
S2
Stát
Švýcarská konfederace
Strany od
470
Strany do
474
Strany počet
5
BibTex
@article{BUT89393, author="Rutul Rajendra {Trivedi} and Lukáš {Hoferek} and Vladimír {Čech}", title="Depth profile of mechanical properties of plasma-polymerized tetravinylsilane films evaluated by cyclic nanoindentation", journal="Surface and Coatings Technology", year="2011", volume="205", number="S2", pages="470--474", issn="0257-8972" }